Patents by Inventor Michiko OISHI

Michiko OISHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ultrasonic probe
    Patent number: 10413276
    Abstract: An ultrasonic probe includes an ultrasonic transducer array and a multilayer body for extracting an electric wiring from each electrode. Transducers are classified into at least a first group and a second group. The multilayer body includes a first FPC layer on which the array is stacked and a second FPC layer on which the first FPC layer is stacked. The first FPC layer and the second FPC layer include upper surface connection pads and lower surface electrode pads which maintain a uniform level at positions spatially corresponding to the respective transducers. FPC layers constituting an FPC multilayer body are bonded to each other to be integrally formed in a region corresponding to the width of the array. On the other hand, the respective FPC layers are not bonded to each other and separated from each other outside the region corresponding to the width of the array.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: September 17, 2019
    Assignee: Canon Medical Svstems Corporation
    Inventors: Yasuhiro Ona, Hiroyuki Shikata, Satoru Tezuka, Satoru Asagiri, Michiko Oishi
  • ULTRASONIC PROBE
    Publication number: 20160007964
    Abstract: An ultrasonic probe includes an ultrasonic transducer array and a multilayer body for extracting an electric wiring from each electrode. Transducers are classified into at least a first group and a second group. The multilayer body includes a first FPC layer on which the array is stacked and a second FPC layer on which the first FPC layer is stacked. The first FPC layer and the second FPC layer include upper surface connection pads and lower surface electrode pads which maintain a uniform level at positions spatially corresponding to the respective transducers. FPC layers constituting an FPC multilayer body are bonded to each other to be integrally formed in a region corresponding to the width of the array. On the other hand, the respective FPC layers are not bonded to each other and separated from each other outside the region corresponding to the width of the array.
    Type: Application
    Filed: September 21, 2015
    Publication date: January 14, 2016
    Applicants: KABUSHIKI KAISHA TOSHIBA, Toshiba Medical Systems Corporation
    Inventors: Yasuhiro ONA, Hiroyuki SHIKATA, Satoru TEZUKA, Satoru ASAGIRI, Michiko OISHI