Patents by Inventor Michiko Ooishi

Michiko Ooishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140103782
    Abstract: An aspect of one embodiment, there is provided an ultrasonic transducer including a plurality of oscillators, each of the oscillator having a convex portion, a printed wiring board provided to be opposed to the convex portion and electrically connected to the convex portion, a resin provided between the oscillator and the printed wiring board, the resin covering at least the convex portion and a portion of the printed wiring board.
    Type: Application
    Filed: December 20, 2013
    Publication date: April 17, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Takashi TOGASAKI, Takeshi Miyagi, Satoru Asagiri, Michiko Ooishi
  • Patent number: 8674587
    Abstract: An aspect of one embodiment, there is provided an ultrasonic transducer including a plurality of oscillators, each of the oscillator having a convex portion, a printed wiring board provided to be opposed to the convex portion, an adhesive material including at least a portion of the convex portion, the adhesive material joining the oscillator and the printed wiring board, and a resin provided between the oscillator and the printed wiring board, the resin covering the convex portion and the adhesive material.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: March 18, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takashi Togasaki, Takeshi Miyagi, Satoru Asagiri, Michiko Ooishi
  • Patent number: 8647280
    Abstract: An ultrasonic probe includes, a transducer, a substrate includes electrodes formed on a front surface and a back surface and electronic components, first flexible wire substrates connected in such a manner that a first end is connected to the transducer and a second end is connected to a electrode at a side of the front surface of the substrate, second flexible wire substrates connected in such a manner that a first end is connected to the transducer and a second end is connected to a electrode at a side of the back surface of the substrate, and a dummy materials including the same rigidity and thickness as those of the first flexible wire substrate is arranged at a space, adjacent to a electrode at the side of the front surface of the substrate, corresponding to the second end of the second flexible wire substrate.
    Type: Grant
    Filed: March 20, 2012
    Date of Patent: February 11, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Michiko Ooishi, Satoru Asagiri, Takashi Togasaki, Takeshi Miyagi
  • Publication number: 20120245470
    Abstract: An ultrasonic probe includes, a transducer, a substrate includes electrodes formed on a front surface and a back surface and electronic components, first flexible wire substrates connected in such a manner that a first end is connected to the transducer and a second end is connected to a electrode at a side of the front surface of the substrate, second flexible wire substrates connected in such a manner that a first end is connected to the transducer and a second end is connected to a electrode at a side of the back surface of the substrate, and a dummy materials including the same rigidity and thickness as those of the first flexible wire substrate is arranged at a space, adjacent to a electrode at the side of the front surface of the substrate, corresponding to the second end of the second flexible wire substrate.
    Type: Application
    Filed: March 20, 2012
    Publication date: September 27, 2012
    Inventors: Michiko Ooishi, Satoru Asagiri, Takashi Togasaki, Takeshi Miyagi
  • Publication number: 20110316387
    Abstract: An aspect of one embodiment, there is provided an ultrasonic transducer including a plurality of oscillators, each of the oscillator having a convex portion, a printed wiring board provided to be opposed to the convex portion, an adhesive material including at least a portion of the convex portion, the adhesive material joining the oscillator and the printed wiring board, and a resin provided between the oscillator and the printed wiring board, the resin covering the convex portion and the adhesive material.
    Type: Application
    Filed: June 23, 2011
    Publication date: December 29, 2011
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takashi TOGASAKI, Takeshi Miyagi, Satoru Asagiri, Michiko Ooishi
  • Publication number: 20110237952
    Abstract: According to one embodiment, an ultrasonic probe comprises piezoelectric elements arranged in the form of a two-dimensional array, a processing IC configured to process signal information obtained from the piezoelectric elements, and a flexible wiring substrate disposed between the piezoelectric elements and the processing IC, with the piezoelectric elements mounted on a front surface, and the processing IC mounted on a rear surface.
    Type: Application
    Filed: March 18, 2011
    Publication date: September 29, 2011
    Inventors: Michiko Ooishi, Satoru Asagiri, Takeshi Miyagi, Takashi Togasaki
  • Patent number: 7304684
    Abstract: An image pickup apparatus includes a first connector arranged on a wiring board, a second connector including an optical lens and being engageable with the first connector, and a photoelectric conversion module on which light is incident from the optical lens, the photoelectric conversion module being fixedly held when the photoelectric conversion module is clamped by the first and second connectors in a state where the first and second connectors are in engagement and coupled relatively to each other.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: December 4, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masao Segawa, Michiko Ooishi, Jun Karasawa, Tomoyuki Sasaki, Jun Asaga
  • Publication number: 20020057468
    Abstract: An image pickup apparatus includes a first connector arranged on a wiring board, a second connector including an optical lens and being engageable with the first connector, and a photoelectric conversion module on which light is incident from the optical lens, the photoelectric conversion module being fixedly held when the photoelectric conversion module is clamped by the first and second connectors in a state where the first and second connectors are in engagement and coupled relatively to each other.
    Type: Application
    Filed: November 13, 2001
    Publication date: May 16, 2002
    Inventors: Masao Segawa, Michiko Ooishi, Jun Karasawa, Tomoyuki Sasaki, Jun Asaga