Patents by Inventor Michimasa Ote

Michimasa Ote has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9005500
    Abstract: When extrusion of a molten resin by means of an extruder is started, a simple polyetherimide resin is melt extruded from a lip portion 7a of a T-die 7, and a film of the simple polyetherimide resin is molded. The molding material is then switched to a resin composition including the polyetherimide resin and a fluorine resin and then a film of the resin composition is continuously extruded and molded from the T-die 7. Having been covered with a very thin film 8a of the simple polyetherimide resin, on a flow passage face of the lip portion 7a of the T-die 7, a resin composition layer 8b including a polyetherimide resin and a fluorine resin, which has affinity with the film 8a, is then formed at a center part.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: April 14, 2015
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Michimasa Ote, Takashi Gonda, Junya Ishida, Kenro Takizawa, Kazuhiro Suzuki, Yuzo Morioka
  • Patent number: 8524133
    Abstract: The present invention provides a method for manufacturing a film for a film capacitor making it possible to produce a film for a film capacitor which has a thickness of 10 ?m or less and which is excellent in a heat resistance and a voltage resistance at a high thickness accuracy by using a polyetherimide resin and provides as well a film for a film capacitor.
    Type: Grant
    Filed: November 1, 2010
    Date of Patent: September 3, 2013
    Assignee: Shin-Etsu Polymer Co., Ltd
    Inventors: Kenro Takizawa, Yuzo Morioka, Kazuhiro Suzuki, Michimasa Ote
  • Publication number: 20110151187
    Abstract: When extrusion of a molten resin by means of an extruder is started, a simple polyetherimide resin is melt extruded from a lip portion 7a of a T-die 7, and a film of the simple polyetherimide resin is molded. The molding material is then switched to a resin composition including the polyetherimide resin and a fluorine resin and then a film of the resin composition is continuously extruded and molded from the T-die 7. Having been covered with a very thin film 8a of the simple polyetherimide resin, on a flow passage face of the lip portion 7a of the T-die 7, a resin composition layer 8b including a polyetherimide resin and a fluorine resin, which has affinity with the film 8a, is then formed at a center part.
    Type: Application
    Filed: December 16, 2010
    Publication date: June 23, 2011
    Applicant: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Michimasa OTE, Takashi Gonda, Junya Ishida, Kenro Takizawa, Kazuhiro Suzuki, Yuzo Morioka
  • Publication number: 20110117348
    Abstract: The present invention provides a method for manufacturing a film for a film capacitor making it possible to produce a film for a film capacitor which has a thickness of 10 ?m or less and which is excellent in a heat resistance and a voltage resistance at a high thickness accuracy by using a polyetherimide resin and provides as well a film for a film capacitor.
    Type: Application
    Filed: November 1, 2010
    Publication date: May 19, 2011
    Applicant: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Kenro TAKIZAWA, Yuzo Morioka, Kazuhiro Suzuki, Michimasa Ote