Patents by Inventor Michinao Nomura

Michinao Nomura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7258151
    Abstract: Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.
    Type: Grant
    Filed: May 2, 2006
    Date of Patent: August 21, 2007
    Assignee: Fujitsu Limited
    Inventors: Michinao Nomura, Yoshiaki Yanagida, Tomokazu Sugiyama
  • Publication number: 20060201633
    Abstract: Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.
    Type: Application
    Filed: May 2, 2006
    Publication date: September 14, 2006
    Inventors: Michinao Nomura, Yoshiaki Yanagida, Tomokazu Sugiyama
  • Patent number: 7070671
    Abstract: Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.
    Type: Grant
    Filed: February 6, 2003
    Date of Patent: July 4, 2006
    Assignee: Fujitsu Limited
    Inventors: Michinao Nomura, Yoshiaki Yanagida, Tomokazu Sugiyama, Koji Sudo
  • Publication number: 20050186887
    Abstract: A processing method includes the steps of elastically deforming a jig together with a work, the jig having been mounted on a work, compressing the work against a polishing surface, and moving the work and the polishing surface relative to each other.
    Type: Application
    Filed: March 31, 2005
    Publication date: August 25, 2005
    Applicant: FUJITSU LIMITED
    Inventors: Michinao Nomura, Yoshiaki Yanagida, Koji Sudo, Shunsuke Sone
  • Patent number: 6687556
    Abstract: A blade as an edged member having separated two forward ends is inserted into an opening of a holder as a U-shaped member, and a gap between the two forward ends of the inserted blade is widened so that a width of the opening is expanded, and a light guide body as a thin plate is inserted into the opening with expanded width, and after that the two forward ends of the blade are drawn from the opening.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: February 3, 2004
    Assignee: Fujitsu Limited
    Inventors: Michinao Nomura, Yoshiaki Yanagida
  • Publication number: 20030119421
    Abstract: Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.
    Type: Application
    Filed: February 6, 2003
    Publication date: June 26, 2003
    Applicant: Fujitsu Limited
    Inventors: Michinao Nomura, Yoshiaki Yanagida, Tomokazu Sugiyama, Koji Sudo
  • Patent number: 6547918
    Abstract: A raw bar stripping off and cleaning jig has a stripping-off member on which transfer tools are placed, a base for supporting raw bars stripped off from the transfer tools, a stripping-off suction member for attracting the raw bars to separate the same from the transfer tools, and a cover member for supporting the raw bars, which are stripped off from the transfer tools and are placed on the base, from the top.
    Type: Grant
    Filed: May 23, 2002
    Date of Patent: April 15, 2003
    Assignee: Fujitsu Limited
    Inventors: Michinao Nomura, Tsutomu Honma
  • Publication number: 20020198620
    Abstract: A blade as an edged member having separated two forward ends is inserted into an opening of a holder as a U-shaped member, and a gap between the two forward ends of the inserted blade is widened so that a width of the opening is expanded, and a light guide body as a thin plate is inserted into the opening with expanded width, and after that the two forward ends of the blade are drawn from the opening.
    Type: Application
    Filed: September 21, 2001
    Publication date: December 26, 2002
    Applicant: Fujitsu Limited
    Inventors: Michinao Nomura, Yoshiaki Yanagida
  • Publication number: 20020139474
    Abstract: A raw bar stripping off and cleaning jig has a stripping-off member on which transfer tools are placed, a base for supporting raw bars stripped off from the transfer tools, a stripping-off suction member for attracting the raw bars to separate the same from the transfer tools, and a cover member for supporting the raw bars, which are stripped off from the transfer tools and are placed on the base, from the top.
    Type: Application
    Filed: May 23, 2002
    Publication date: October 3, 2002
    Applicant: FUJITSU LIMITED
    Inventors: Michinao Nomura, Tsutomu Honma
  • Patent number: 6419000
    Abstract: A raw bar stripping off and cleaning jig has a stripping-off member on which transfer tools are placed, a base for supporting raw ban to be stripped off from the transfer tools, a stripping-off suction member for attracting the raw bars to separate the same from the transfer tools, and a cover member for supporting the raw bars in the base after stripping.
    Type: Grant
    Filed: January 20, 2000
    Date of Patent: July 16, 2002
    Assignee: Fujitsu Limited
    Inventors: Michinao Nomura, Tsutomu Honma
  • Publication number: 20020016130
    Abstract: Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.
    Type: Application
    Filed: January 24, 2001
    Publication date: February 7, 2002
    Applicant: FUJITSU LIMITED
    Inventors: Michinao Nomura, Yoshiaki Yanagida, Tomokazu Sugiyama, Koji Sudo