Patents by Inventor Michinori Matsubayashi

Michinori Matsubayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5579231
    Abstract: The present invention is to provide an equipment production management system, in which the electronic equipment is designed corresponding to an order from customers, which enables unified preparation from derivation of equipment corresponding to the customer conditions concerning equipment installation design, and construction associated drawing design. The system includes a terminal unit and a central control system, in which is provided a customer base order information file, design data file, a design know-how information file established by making a know-how library on the equipment installation design as input files. The central processing system includes an installation designing section corresponding to installation design for respective stages from overall layout to installation of the elementary parts.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: November 26, 1996
    Assignee: Fujitsu Limited
    Inventors: Kouji Sudou, Masao Shukuya, Katsuo Okuyama, Masao Ishiwata, Hidetoshi Uchibori, Toshinari Matsui, Shigeru Kubo, Michinori Matsubayashi, Kazuhide Toyoda, Eiko Takei, Hidekazu Morihiro, Masayoshi Suzuki, Hideo Ohata
  • Patent number: 5413164
    Abstract: For use in the fabrication of electronic circuit modules, there is provided a heating furnace which can be arbitrarily set in a desired temperature profile. The furnace includes a plural number of independently controllable heaters located in spaced positions to provide a plural number of heating zones in the furnace, and a plural number of cooling panels provided in the heating zones of the respective heaters. Each heater is independently controlled according to a specified type of substrate to establish a temperature profile for the specified substrate type in the furnace to carry out the curing of a sealing synthetic resin material of a semiconductor device and the reflow soldering of surface mounting devices in one and single furnace.
    Type: Grant
    Filed: August 29, 1991
    Date of Patent: May 9, 1995
    Assignee: Fujitsu Limited
    Inventors: Yasuhiro Teshima, Mamoru Niishiro, Michinori Matsubayashi