Patents by Inventor Michio Aizawa

Michio Aizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5916675
    Abstract: Described is an adhesive containing a polycarbodiimide resin having repeating units represented by the following formula:.paren open-st.R--N.dbd.C.dbd.N.paren close-st..sub.nwherein R is a divalent hydrocarbon group and n is an integer of 5 to 250, and also described is a flexible printed circuit board and a coverlay film fabricated using the above-described polycarbodiimide resin-containing adhesive.
    Type: Grant
    Filed: June 12, 1997
    Date of Patent: June 29, 1999
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yasuyoshi Komoto, Akira Hayashida, Michio Aizawa, Hitoshi Arai, Ken Yahata