Patents by Inventor Michio Futakuchi

Michio Futakuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020066094
    Abstract: In a software distribution system and a method of distributing software which utilizes a network such as the Internet, software, which is divided into unit programs, is transmitted and distributed through a network, and at least one unit program is distributed recorded in a recording medium.
    Type: Application
    Filed: December 6, 2000
    Publication date: May 30, 2002
    Inventor: Michio Futakuchi
  • Publication number: 20010051330
    Abstract: An apparatus for providing remote teaching to a student at a terminal through a network. The apparatus comprises a question database including questions, an answer database including an answer key, and a comment database including one or more common wrong answers students are apt to make, prepared respectively for each question. The comment database also includes mistake indicating comments to the respective common wrong answers. The mistake indicating comments are designed to let a student know that his/her answer is wrong and why. The apparatus further comprises a control unit configured to, after an answer is received from the student, determine based on the answer key whether the answer is right. The control unit is further configured to, when the answer is not right, select from the comment database a mistake indicating comment corresponding to both the question given to the student and his/her answer for providing the comment to the student.
    Type: Application
    Filed: December 11, 2000
    Publication date: December 13, 2001
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Michio Futakuchi
  • Patent number: 6308938
    Abstract: A semiconductor integrated circuit device having a ball grid array package includes a core material including a semiconductor chip and a sealing resin layer surrounding the chip and surface materials including a carrier base and a reinforcement in a sandwich structure for high stiffness against being and high reliability of connection to a printed wiring board even during heat cycling.
    Type: Grant
    Filed: January 30, 1998
    Date of Patent: October 30, 2001
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Michio Futakuchi
  • Patent number: 5661223
    Abstract: A resin composition for a laminate comprises 100 parts by weight of a polyfunctional epoxy resin (I) obtained by (i)(1) glycidylizing a polycomposite formed from a blend of brominated bisphenol A and bisphenol A, or brominated bisphenol A and formaldehyde; or (2) a mixture of a polyfunctional epoxy resin and a bisphenol A-advanced epoxy resin reacted with brominated bisphenol A in a hydroxyl:epoxy equivalent ratio of from 0.05-0.5:1 and (ii) a bisphenol A-formaldehyde phenolic resin having a weight average molecular weight of from 1,000-10,000 in a hydroxyl:epoxy equivalent ratio with respect to epoxy resin (i) of from 0.7-1.2:1; and (II) from 1-60 parts by weight of a straight chain polymer (c) such as a poly(ether)sulfone, aromatic polyester, phenoxy resin, polyparabanic acid, polyetherimide or polyphenylene sulfide.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: August 26, 1997
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Seiji Oka, Mitsuhiro Nonogaki, Takumi Kikuchi, Takashi Takahama, Hiroyuki Nakajima, Michio Futakuchi
  • Patent number: 5278259
    Abstract: An epoxy resin composition comprising:(A) as a resin chief material a bisphenol A type epoxy resin having the following formula (1), ##STR1## wherein n is 0 to 10, R.sup.1 and R.sup.2 each represents a glycidyl group, and A.sup.1 to A.sup.8 each represents a hydrogen atom or a bromine atom;(B) as an epoxy resin curing agent,(b1) a bisphenol A or a brominated product thereof having formula (1) (wherein n is 0, R.sup.1 and R.sup.2 each represents a hydrogen atom, and A.sup.1 to A.sup.4 each represents a hydrogen atom or a bromine atom), or(b2) a novolac resin of a bisphenol A or a brominated product thereof that is obtained by linking two or more molecules of a bisphenol A or a brominated product thereof having formula (1) (wherein n is 0, R.sup.1 and R.sup.2 each represents a hydrogen atom, and A.sup.1 to A.sup.4 each represents a hydrogen atom or a bromine atom), through a methylene group(s) at any of A.sup.1 to A.sup.
    Type: Grant
    Filed: April 12, 1991
    Date of Patent: January 11, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Michio Futakuchi, Hiroyuki Nakajima, Takashi Takahama
  • Patent number: 4385952
    Abstract: A method of producing a fiber reinforced plastic product which includes the steps of winding a strand or rovings on a mandrel prepared by a filament winding method in three directions of substantially +60 degrees, -60 degrees and 0 degrees to the axis of the mandrel in desired turns to form braid fabric reinforced in three directions; impregnating a resin before or after the winding step; cutting out the resin impregnated braid fabric from the mandrel to obtain a prepreg reinforced in three directions; and fabricating the prepreg in a desired configuration for a product by heating and a fiber reinforced plastic product made by the method.
    Type: Grant
    Filed: August 27, 1981
    Date of Patent: May 31, 1983
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Michio Futakuchi, Hidetoshi Kitakoga