Patents by Inventor Michio IMAYOSHI

Michio IMAYOSHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component mounting substrate, electronic device, and electronic module
    Patent number: 10985098
    Abstract: An electronic component mounting substrate includes an insulating substrate having a rectangular shape in a plan view of the electronic component mounting substrate, the insulating substrate including a mounting portion on a principal face thereof for mounting an electronic component; and first via conductor groups each including first via conductors and second via conductor groups each including second via conductors, the first via conductors and the second via conductors penetrating through the insulating substrate in a thickness direction thereof, a number of the second via conductors being larger than that of the first via conductors, the mounting portion, the first via conductor groups, and the second via conductor groups being disposed so as not to overlap each other in a transparent plan view of the electronic component mounting substrate, the first via conductor groups being located between the mounting portion and the second via conductor groups, respectively.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: April 20, 2021
    Assignee: KYOCERA CORPORATION
    Inventor: Michio Imayoshi
  • Wiring board, electronic device, and electronic module
    Patent number: 10699993
    Abstract: A wiring board includes an insulating substrate that is rectangular in a plan view, a plurality of mount electrodes arranged to face each other on a first main surface of the insulating substrate along a pair of opposing sides of the insulating substrate in a plan view, a plurality of terminal electrodes arranged to face each other on a second main surface of the insulating substrate along the pair of opposing sides of the insulating substrate in a perspective plan view, and an inner metal layer arranged inside the insulating substrate and extending in a direction perpendicular to the pair of opposing sides of the insulating substrate in a perspective plan view.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: June 30, 2020
    Assignee: KYOCERA CORPORATION
    Inventors: Michio Imayoshi, Yousuke Moriyama
  • WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
    Publication number: 20190273036
    Abstract: A wiring board includes an insulating substrate that is rectangular in a plan view, a plurality of mount electrodes arranged to face each other on a first main surface of the insulating substrate along a pair of opposing sides of the insulating substrate in a plan view, a plurality of terminal electrodes arranged to face each other on a second main surface of the insulating substrate along the pair of opposing sides of the insulating substrate in a perspective plan view, and an inner metal layer arranged inside the insulating substrate and extending in a direction perpendicular to the pair of opposing sides of the insulating substrate in a perspective plan view.
    Type: Application
    Filed: May 21, 2019
    Publication date: September 5, 2019
    Applicant: KYOCERA Corporation
    Inventors: Michio IMAYOSHI, Yousuke MORIYAMA
  • Wiring board, electronic device, and electronic module
    Patent number: 10319672
    Abstract: A wiring board includes an insulating substrate that is rectangular in a plan view, a plurality of mount electrodes arranged to face each other on a first main surface of the insulating substrate along a pair of opposing sides of the insulating substrate in a plan view, a plurality of terminal electrodes arranged to face each other on a second main surface of the insulating substrate along the pair of opposing sides of the insulating substrate in a perspective plan view, and an inner metal layer arranged inside the insulating substrate and extending in a direction perpendicular to the pair of opposing sides of the insulating substrate in a perspective plan view.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: June 11, 2019
    Assignee: KYOCERA CORPORATION
    Inventors: Michio Imayoshi, Yousuke Moriyama
  • ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
    Publication number: 20190148278
    Abstract: An electronic component mounting substrate includes an insulating substrate having a rectangular shape in a plan view of the electronic component mounting substrate, the insulating substrate including a mounting portion on a principal face thereof for mounting an electronic component; and first via conductor groups each including first via conductors and second via conductor groups each including second via conductors, the first via conductors and the second via conductors penetrating through the insulating substrate in a thickness direction thereof, a number of the second via conductors being larger than that of the first via conductors, the mounting portion, the first via conductor groups, and the second via conductor groups being disposed so as not to overlap each other in a transparent plan view of the electronic component mounting substrate, the first via conductor groups being located between the mounting portion and the second via conductor groups, respectively.
    Type: Application
    Filed: April 25, 2017
    Publication date: May 16, 2019
    Applicant: KYOCERA Corporation
    Inventor: Michio IMAYOSHI
  • WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
    Publication number: 20180151483
    Abstract: A wiring board includes an insulating substrate that is rectangular in a plan view, a plurality of mount electrodes arranged to face each other on a first main surface of the insulating substrate along a pair of opposing sides of the insulating substrate in a plan view, a plurality of terminal electrodes arranged to face each other on a second main surface of the insulating substrate along the pair of opposing sides of the insulating substrate in a perspective plan view, and an inner metal layer arranged inside the insulating substrate and extending in a direction perpendicular to the pair of opposing sides of the insulating substrate in a perspective plan view.
    Type: Application
    Filed: June 23, 2016
    Publication date: May 31, 2018
    Applicant: KYOCERA Corporation
    Inventors: Michio IMAYOSHI, Yousuke MORIYAMA