Abstract: In this method of packing electronic parts electronic parts are inserted into a plurality of containers each of which has an opening on the upper surface thereof. These containers are juxtaposed side by side. A single common pressing plate is disposed over the containers so as to cover their openings. The containers and pressing plate are packed together in a sack under vacuum.

Abstract: An optoelectronic semiconductor device for use in an optical transmission system comprises a stem for mounting an optoelectronic semiconductor element thereon and a cap within which an optical fiber, optically communicating with the optoelectronic semiconductor element, is arranged. An end of the optical fiber within the cap is exposed on the cap surface. A screw is formed on the outer suface of the cap and a nut, which engages the screw, is provided for optically connecting optical transmission fiber with the optical fiber within the cap.

Abstract: A transistor device which is suitable for a high-frequency and high-power transistor is disclosed. The transistor device comprises a first ceramic plate and a second ceramic plate mounted on the first ceramic plate. The first ceramic plate is provided with a transistor chip element and also emitter, base and collector leads which are formed thereon, each of these leads being connected to a corresponding emitter, base and collector area of the transistor chip element, respectively. The second ceramic plate is provided with emitter, base and collector guide leads formed thereon. These emitter, base and collector guide leads have emitter, base and collector lead terminals, respectively. The emitter, base and collector leads of the first ceramic plate are electrically connected with the corresponding emitter, base and collector guide leads of the second ceramic plate, respectively, by means of respective longitudinal conductive paths formed along and on the side surface of the second ceramic plate.