Abstract: A method of manufacturing an electronic component including a step wherein green-sheets each having one main surface on which a number of first interior electrodes or second interior electrodes are printed and green-sheets each having no printed electrodes are laminated in a direction orthogonally intersecting the respective main surfaces of the green-sheets so as to form a block, which is then fired. The fired block is cut or sliced in the direction orthogonally intersecting the main surface of the green-sheets so as to form a mother board with respective ends of the first interior electrodes and the second interior electrodes exposed on one main surface and the other main surface of the mother board, respectively.

Abstract: A thick layer of electrode material paint is formed on a flat surface. A film of the electrode material paint is formed on an element by dipping the element into the layer. In the next step, a thinner layer of the electrode material paint than the aforementioned layer is formed on a flat surface. Into the thinner layer of the electrode material paint, the film of the electrode material paint formed on the element is dipped. Alternatively, the element may first be dipped into a thinner layer of the electrode material paint so that a thin film of the electrode material paint is formed on the element. The film formed on the element is then dipped into a thick layer of the electrode material paint and then again into a thin layer of the electrode material paint in such order. By firing the film of the electrode material paint obtained in this manner, an electronic element having external electrodes of a uniform thickness can be obtained.