Patents by Inventor Michio Kanai

Michio Kanai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9312162
    Abstract: A dicing sheet includes a base, an intermediate layer on one face of the base, and an pressure sensitive adhesive layer provided on the intermediate layer and having the thickness of 8 to 30 ?m. The pressure sensitive adhesive layer includes a compound having an energy ray curable double bond in a molecule, and a storage elasticity G? at 23° C. of the pressure sensitive adhesive layer before curing is larger than 4 times of a storage elasticity at 23° C. of the intermediate layer. When the dicing sheet is laminated via the adhesive sheet on a wafer formed with a cylinder shape electrodes having a height of 15 ?m and a diameter of 15 ?m at a pitch of 40 ?m having 3 rows 3 columns in equal spacing, at a center of the electrode of the cylinder shape electrodes formed in 3 rows 3 columns, the pressure sensitive adhesive layer does not contact at a part of a height of 7.5 ?m or less of the electrode.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: April 12, 2016
    Assignee: LINTEC Corporation
    Inventors: Yosuke Sato, Michio Kanai, Hayato Nakanishi
  • Publication number: 20100317173
    Abstract: A process for manufacturing a semiconductor device through an inlined operation includes the step of attaching a dicing tape to the ground surface immediately after the completion of the grinding of the reverse side. The dicing tape includes a base material and, undetachably laminated thereon, an adhesive layer that includes an adhesive component and an epoxy group-containing compound being free but that does not contain any hardener for epoxy resins.
    Type: Application
    Filed: January 29, 2008
    Publication date: December 16, 2010
    Applicant: LINTEC CORPORATION
    Inventor: Michio Kanai
  • Patent number: 6605345
    Abstract: Disclosed is an ultraviolet-curable pressure sensitive adhesive composition comprising an ultraviolet-curable pressure sensitive adhesive component and a phosphorus type photopolymerization initiator. Also disclosed is an ultraviolet-curable pressure sensitive adhesive sheet obtained by coating a substrate with the ultraviolet-curable pressure sensitive adhesive composition. The ultraviolet-curable pressure sensitive adhesive composition is capable of retaining ultraviolet curing properties even if the ultraviolet-curable pressure sensitive adhesive sheet is brought into contact with wash water for a long period of time.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: August 12, 2003
    Assignee: Lintec Corporation
    Inventors: Michio Kanai, Hideki Numazawa
  • Publication number: 20020019454
    Abstract: Disclosed is an ultraviolet-curable pressure sensitive adhesive composition comprising an ultraviolet-curable pressure sensitive adhesive component and a phosphorus type photopolymerization initiator. Also disclosed is an ultraviolet-curable pressure sensitive adhesive sheet obtained by coating a substrate with the ultraviolet-curable pressure sensitive adhesive composition. The ultraviolet-curable pressure sensitive adhesive composition is capable of retaining ultraviolet curing properties even if the ultraviolet-curable pressure sensitive adhesive sheet is brought into contact with wash water for a long period of time.
    Type: Application
    Filed: June 28, 2001
    Publication date: February 14, 2002
    Applicant: LINTEC CORPORATION
    Inventors: Michio Kanai, Hideki Numazawa