Abstract: A neutron moderator includes a neutron generator; a neutron moderating material arranged on one side of the neutron generator; a gamma ray shielding material covering an external surface of the neutron moderating material; and a thermal neutron absorbing material covering the external surface of the neutron moderating material except a side where the neutron generator is arranged.

Abstract: A neutron moderator includes a neutron generator; a neutron moderating material arranged on one side of the neutron generator; a gamma ray shielding material covering an external surface of the neutron moderating material; and a thermal neutron absorbing material covering the external surface of the neutron moderating material except a side where the neutron generator is arranged.

Abstract: This metal gasket is formed by laminating a pair of bead plates and a pair of intermediate plates, and capable of setting the temperature distribution thereof uniform by efficiently cooling high-temperature regions which are in the vicinity of swirl chambers without causing a decrease in the rigidity and strength thereof. The portions of the bead plates which are in the vicinity of the parts thereof in which the swirl chambers are positioned are provided with coolant-contact areas surrounded by half beads formed on the bead plates, these coolant-contact areas being provided with holes. The wall surfaces of these holes directly contact the cooling water flowing in a water jacket in a cylinder head, and fulfil the function of radiating the heat transmitted from a high-temperature combustion gas thereto.

Abstract: A method for manufacturing a plastic encapsulated semiconductor device is provided which comprises the steps of: clamping by upper and lower molds at least external leads and strips of a semiconductor device assembly formed using a lead frame which has a first connecting band connected to the external leads extending from one side of a substrate support further used as a heat sink, and a second connecting band connected to the strips having portions of small cross-sectional areas and of a predetermined length and extending from the other side of the substrate support, the cross sections being perpendicular to an extending direction of the strips, so that the substrate support may float in a cavity formed by the upper and lower molds and parts of the portions of small cross-sectional areas may be disposed in the cavity and the remaining parts thereof may be disposed between the upper and lower molds; injecting a plastic into the cavity; and cutting the portions of small cross-sectional areas of the strips whic

Abstract: A process for preparing an acrylic or methacrylic acid ester comprising esterifying the acrylic or methacrylic acid with an alcohol in a water-insoluble and non-reactive organic solvent in the presence of an acid catalyst, the volume ratio of the organic solvent phase to an aqueous solution phase of the acid catalyst being as small as 0.1 to 1.0, whereby a reactor is allowed to be small-sized and a conversion of the esterification is kept high. The acrylic or methacrylic acid ester is useful as a starting material of an acrylic resin or acrylic resin coating, an adhesive or the like.

Abstract: A method for manufacturing a plastic encapsulated semiconductor device is provided which comprises the steps of: clamping by upper and lower molds at least external leads and strips of a semiconductor device assembly formed using a lead frame which has a first connecting band connected to the external leads extending from one side of a substrate support further used as a heat sink, and a second connecting band connected to the strips having portions of small cross-sectional areas and of a predetermined length and extending from the other side of the substrate support, the cross sections being perpendicular to an extending direction of the strips, so that the substrate support may float in a cavity formed by the upper and lower molds and parts of the portions of small cross-sectional areas may be disposed in the cavity and the remaining parts thereof may be disposed between the upper and lower molds; injecting a plastic into the cavity; and cutting the portions of small cross-sectional areas of the strips whic

Abstract: A sheet molding material comprising (1) an interlayer containing a photopolymerizable resin and a photocuring agent for the photopolymerizable resin, and (2) a surface layer of a thermosetting resin containing a heat curing agent for the thermosetting resin on both surfaces of the interlayer (1); and a process for the production of the sheet molding material.

Abstract: A sheet molding material comprising (1) an interlayer containing a photopolymerizable resin and a photocuring agent for the photopolymerizable resin, and (2) a surface layer of a thermosetting resin containing a heat curing agent for the thermosetting resin on both surfaces of the interlayer (1); and a process for the production of the sheet molding material.