Patents by Inventor Michio Nawata

Michio Nawata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for the production of vinyl compound
    Patent number: 7193019
    Abstract: A process for the production of a vinyl compound of the formula (1), which process comprises reacting a bifunctional phenylene ether oligomer of the formula (2) with a vinylbenzyl halide in an aprotic polar solvent in the presence of an alkali metal alkoxide and then adding the reaction solution to water or a water/alcohol mixed solution to precipitate a solid
    Type: Grant
    Filed: October 14, 2004
    Date of Patent: March 20, 2007
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Yasumasa Norisue, Makoto Miyamoto, Daisuke Ohno, Kenji Ishii, Michio Nawata
  • Resin composition and prepreg for laminate and metal-clad laminate
    Patent number: 7192651
    Abstract: A resin composition for a laminate, containing at least 10% by weight of a vinyl compound represented by the formula (1), and a prepreg and a metal-clad laminate using the resin composition.
    Type: Grant
    Filed: August 17, 2004
    Date of Patent: March 20, 2007
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Daisuke Ohno, Kenji Ishii, Yasumasa Norisue, Michio Nawata, Yoshinori Kondo, Mitsuru Nozaki, Seiji Shika
  • Curable resin composition and cured product thereof
    Patent number: 7071266
    Abstract: A curable resin composition containing a polyfunctional cyanate ester resin and a bifunctional phenylene ether oligomer having a number average molecular weight of 500 to 3,000 and having a specific structure represented by the formula (1), and a cured product thereof.
    Type: Grant
    Filed: December 30, 2003
    Date of Patent: July 4, 2006
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kenji Ishii, Yasumasa Norisue, Daisuke Ohno, Michio Nawata
  • Process for the production of vinyl compound
    Publication number: 20050090624
    Abstract: A process for the production of a vinyl compound of the formula (1), which process comprises reacting a bifunctional phenylene ether oligomer of the formula (2) with a vinylbenzyl halide in an aprotic polar solvent in the presence of an alkali metal alkoxide and then adding the reaction solution to water or a water/alcohol mixed solution to precipitate a solid
    Type: Application
    Filed: October 14, 2004
    Publication date: April 28, 2005
    Inventors: Yasumasa Norisue, Makoto Miyamoto, Daisuke Ohno, Kenji Ishii, Michio Nawata
  • Resin composition and prepreg for laminate and metal-clad laminate
    Publication number: 20050042466
    Abstract: A resin composition for a laminate, containing at least 10% by weight of a vinyl compound represented by the formula (1), and a prepreg and a metal-clad laminate using the resin composition.
    Type: Application
    Filed: August 17, 2004
    Publication date: February 24, 2005
    Inventors: Daisuke Ohno, Kenji Ishii, Yasumasa Norisue, Michio Nawata, Yoshinori Kondo, Mitsuru Nozaki, Seiji Shika
  • Curable resin composition and cured product thereof
    Publication number: 20040152848
    Abstract: A curable resin composition containing a polyfunctional cyanate ester resin and a bifunctional phenylene ether oligomer having a number average molecular weight of 500 to 3,000 and having a specific structure represented by the formula (1), and a cured product thereof.
    Type: Application
    Filed: December 30, 2003
    Publication date: August 5, 2004
    Inventors: Kenji Ishii, Yasumasa Norisue, Daisuke Ohno, Michio Nawata
  • Epoxy resin curing agent, curable epoxy resin composition and cured product
    Publication number: 20040147715
    Abstract: An epoxy resin curing agent having a number average molecular weight of 500 to 3,000, represented by the formula (1), and a cured product thereof.
    Type: Application
    Filed: January 20, 2004
    Publication date: July 29, 2004
    Inventors: Kenji Ishii, Yasumasa Norisue, Daisuke Ohno, Michio Nawata