Patents by Inventor Michio Ogawa
Michio Ogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240301234Abstract: An object of the present invention is to provide a powder component of which a coating film having excellent transparency can be formed, a resin composition for coating, and a coating film. A powder component of the present invention is a powder component containing a polyarylate containing a repeating unit represented by Formula (A-I) and a repeating unit represented by Formula (A-II), and a compound that is different from the polyarylate and that has a repeating unit represented by Formula (B), in which a value obtained by subtracting a measured value 1 from a measured value 2 is 2,000 ppm by mass or less. Measured value 1: a proportion of a mass of a compound represented by Formula (C) in the powder component with respect to a whole mass of the powder component. Measured value 2: a proportion of the mass of the compound represented by Formula (C) in a mixture obtained by mixing the powder component with diethylamine with respect to the whole mass of the powder component.Type: ApplicationFiled: May 15, 2024Publication date: September 12, 2024Applicant: FUJIFILM CorporationInventors: Taiki OGAWA, Koji HIRONAKA, Yutaka NOZOE, Junko YAMASHITA, Michio ARAI, Keisuke USHIROGATA
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Patent number: 12087651Abstract: An object is to provide a technique capable of suppressing an occurrence of a non-filled portion. A semiconductor device includes a base plate, a case, and a semiconductor element. The semiconductor element is disposed in a space of the base plate and the case. The semiconductor device includes a lead electrode. The lead electrode is connected to an upper surface of the semiconductor element in the space. The semiconductor device includes a raised portion. The raised portion is disposed on an upper surface of the lead electrode in the space. The semiconductor device includes a sealing resin. The sealing resin seals the semiconductor element and the lead electrode in the space.Type: GrantFiled: November 19, 2021Date of Patent: September 10, 2024Assignee: Mitsubishi Electric CorporationInventors: Kazuma Noda, Satoshi Kondo, Junji Fujino, Michio Ogawa
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Publication number: 20230118890Abstract: A power module includes an insulating substrate, a heat dissipation member, and an electrode plate. An IGBT and a diode are mounted on the insulating substrate. The heat dissipation member is bonded to the insulating substrate by first solder. The electrode plate is disposed so as to overlap at least a part of the semiconductor element. The main surface of the insulating substrate is curved so as to have a shape convex toward the heat dissipation member. The first solder is thicker at the edges than at the center in a plan view. The semiconductor element is bonded to the electrode plate by second solder.Type: ApplicationFiled: March 25, 2021Publication date: April 20, 2023Applicant: Mitsubishi Electric CorporationInventors: Junji FUJINO, Michio OGAWA, Chika KAWAZOE, Fumio WADA, Satoru ISHIKAWA
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Publication number: 20220270941Abstract: An object is to provide a technique capable of suppressing an occurrence of a non-filled portion. A semiconductor device includes a base plate, a case, and a semiconductor element. The semiconductor element is disposed in a space of the base plate and the case. The semiconductor device includes a lead electrode. The lead electrode is connected to an upper surface of the semiconductor element in the space. The semiconductor device includes a raised portion. The raised portion is disposed on an upper surface of the lead electrode in the space. The semiconductor device includes a sealing resin. The sealing resin seals the semiconductor element and the lead electrode in the space.Type: ApplicationFiled: November 19, 2021Publication date: August 25, 2022Applicant: Mitsubishi Electric CorporationInventors: Kazuma Noda, Satoshi Kondo, Junji Fujino, Michio Ogawa
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Publication number: 20170151673Abstract: A manipulator system includes a manipulator unit to pick up one object from objects placed on a first place, a recognition unit to perform a first recognition process recognizing the one object to be picked up from the first place, and a second recognition process recognizing an orientation of the one object picked up from the first place, and a controller to control a first transfer operation, and a second transfer operation. When the first transfer operation is performed, the controller instructs the manipulator unit to pick up and move the one object recognized by the first recognition process to an outside of the first place. When the second transfer operation is performed, the controller instructs the manipulator unit to transfer the one object to a second place by setting the orientation of the one object with an orientation determined based on a recognition result of the second recognition process.Type: ApplicationFiled: November 29, 2016Publication date: June 1, 2017Inventors: Takeshi KOBAYASHI, Christian Hruscha, Michio Ogawa
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Patent number: 9638979Abstract: The present invention relates to a light control film, comprising: two transparent electroconductive substrates; and a light control layer sandwiched between the two transparent electroconductive substrates, wherein the light control layer contains a resin matrix and a light control suspension dispersed in the resin matrix, and the concentration of the light control suspension in the vicinity of each of the transparent electroconductive substrates is smaller than that of the light control suspension in the middle in the thickness direction of the light control layer.Type: GrantFiled: December 21, 2007Date of Patent: May 2, 2017Assignee: HITACHI CHEMICAL COMPANY, LTD.Inventors: Osamu Higashida, Michio Ogawa
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Patent number: 8817360Abstract: A method for producing a light-modulating film in which a light-modulating layer is sandwiched between two transparent resin substrates, the light-modulating layer being formed by use of a light-modulating material containing: a polymeric medium for forming a resin matrix; and a light-modulating suspension, includes the following steps: step (a) of applying the light-modulating material to one (a first transparent resin substrate: of the transparent resin substrates; step (b) of bonding the other transparent resin substrate (a second transparent resin substrate) onto the light-modulating material applied to the first transparent resin substrate; and step (c) of irradiating the light-modulating material sandwiched between the first transparent resin substrate and the second transparent resin substrate with an energy ray to cure the polymeric medium for forming the resin matrix contained in the light-modulating material, thereby forming the light-modulating layer to yield the light-modulating film.Type: GrantFiled: March 5, 2009Date of Patent: August 26, 2014Assignee: Hitachi Chemical Company, Ltd.Inventors: Shigeshi Ohno, Michio Ogawa, Toshiaki Chiba
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Patent number: 8779076Abstract: The present invention provides a thermoplastic acrylic resin comprising (i) a repeating unit derived from a methacrylate monomer, (ii) a repeating unit derived from a vinyl aromatic monomer, (iii) a repeating unit derived from an aromatic group-containing methacrylate monomer, and (iv) a cyclic acid anhydride repeating unit, and a molding for optical material comprising the same.Type: GrantFiled: December 24, 2008Date of Patent: July 15, 2014Assignee: Asahi Kasei Chemicals CorporationInventors: Masami Yonemura, Mayuko Kimura, Michio Ogawa
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Publication number: 20110263133Abstract: A semiconductor device manufacturing apparatus includes: an accommodation section accommodating an application object; an irradiation section irradiating the application object taken out from the accommodation section with ultraviolet light; an application section including a stage allowing the application object to be placed thereon and an application head discharging a plurality of droplets of an adhesive to the application object placed on the stage, the application section applying the adhesive through the application head to the application object which is irradiated by ultraviolet light through the irradiation section and is placed on the stage; a drying section drying the adhesive applied on the application object with heat; and a transport section including a hand supporting the application object, the transport section which is capable of transporting the application object accommodated in the accommodation section to the irradiation section, the application section, and the drying section.Type: ApplicationFiled: April 22, 2011Publication date: October 27, 2011Applicants: Kabushiki Kaisha Toshiba, SHIBAURA MECHATRONICS CORPORATIONInventors: Satoru Hara, Shingo Tamai, Akihiro Shigeyama, Michio Ogawa, Hitoshi Aoyagi, Hiroyuki Tanaka, Yasuo Tane, Yukio Katamura
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Publication number: 20110013260Abstract: Disclosed is a method for producing a light-modulating film in which a light-modulating layer is sandwiched between two transparent resin substrates, the light-modulating layer being formed by use of a light-modulating material containing: a polymeric medium for forming a resin matrix; and a light-modulating suspension, the method comprising the following steps. Using this method, a light-modulating film can be obtained which has a wholly uniform external appearance and an excellent adhesiveness between its light-modulating layer and transparent resin substrate.Type: ApplicationFiled: March 5, 2009Publication date: January 20, 2011Inventors: Shigeshi Ohno, Michio Ogawa, Toshiaki Chiba
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Publication number: 20110009585Abstract: The present invention provides a thermoplastic acrylic resin comprising (i) a repeating unit derived from a methacrylate monomer, (ii) a repeating unit derived from a vinyl aromatic monomer, (iii) a repeating unit derived from an aromatic group-containing methacrylate monomer, and (iv) a cyclic acid anhydride repeating unit, and a molding for optical material comprising the same.Type: ApplicationFiled: December 24, 2008Publication date: January 13, 2011Inventors: Masami Yonemura, Mayuko Kimura, Michio Ogawa
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Publication number: 20100047593Abstract: The present invention relates to a light control film, comprising: two transparent electroconductive substrates; and a light control layer sandwiched between the two transparent electroconductive substrates, wherein the light control layer contains a resin matrix and a light control suspension dispersed in the resin matrix, and the concentration of the light control suspension in the vicinity of each of the transparent electroconductive substrates is smaller than that of the light control suspension in the middle in the thickness direction of the light control layer.Type: ApplicationFiled: December 21, 2007Publication date: February 25, 2010Inventors: Osamu Higashida, Michio Ogawa
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Patent number: 4978609Abstract: The present invention relates to monoclonal antibodies having high affinity to human pancreatic PLA.sub.2, the production thereof, hybridomas producing them and an immunoassay for human pancreatic PLA.sub.2 using them.Type: GrantFiled: March 25, 1988Date of Patent: December 18, 1990Assignee: Shionogi & Co., Ltd.Inventors: Atsushi Misaki, Masao Kono, Michio Ogawa, Mitsuhiro Okamoto
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Patent number: D256920Type: GrantFiled: February 16, 1978Date of Patent: September 16, 1980Assignee: Sharp Kabushiki KaishaInventors: Hiroshi Takashima, Hiroshi Oi, Michio Ogawa
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Patent number: D344941Type: GrantFiled: October 6, 1992Date of Patent: March 8, 1994Assignee: Sharp Kabushiki KaishaInventors: Michio Ogawa, Noriaki Itai
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Patent number: D356082Type: GrantFiled: May 27, 1993Date of Patent: March 7, 1995Assignee: Sharp Kabushiki KaishaInventors: Michio Ogawa, Satoshi Mizuno
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Patent number: D356083Type: GrantFiled: May 27, 1993Date of Patent: March 7, 1995Assignee: Sharp Kabushiki KaishaInventors: Michio Ogawa, Kouichi Iida