Abstract: A thermoelectric power generation system 20 includes a heat exchanger 1 having double tubes which are an inner tube 1a and an outer tube 1b, and a thermoelectric power generation module 2 mounted between the inner tube and the outer tube. The thermoelectric power generation module generates thermoelectric power using a temperature difference between a medium inside the inner tube and a medium outside the outer tube, and a highly thermal conductive elastic sheet 3a, 3b is mounted between the thermoelectric power generation module and the inner tube and/or the outer tube in close contact therewith.

Abstract: A cold insulation container includes: a cold insulation storage including a coolant vessel; a circulating air fan that causes cold air from the coolant vessel to circulate in the cold insulation storage; a thermoelectric generating module attached to an outer surface of the coolant vessel; and a temperature controller that adjusts a temperature in the cold insulation storage. A temperature difference between the coolant vessel and circulating cold air in the cold insulation storage causes the temperature controller and the circulating air fan to be driven by thermoelectric power generated by the thermoelectric generating module.

Abstract: Provided is a thermoelectric generation module including a plurality of p-type thermoelectric elements 24a and a plurality of n-type thermoelectric elements 24b alternately connected in series and mounted with sandwiched by first and second flexible printed circuit boards 32, 33. The p-type thermoelectric elements and the n-type thermoelectric elements have a chip size of 1 mm or less and 0.2 mm or greater and a height of 0.8 mm or greater and 3 mm or less.

Abstract: A tubular heat exchanger with a thermoelectric power generation function includes an inner tube 4 in which coolant flows, a thermoelectric power generation module 5 attached to an outer peripheral surface of the inner tube 4, an outer tube 3 attached to an outer peripheral surface of the thermoelectric power generation module 5, and heat collection fins 6 provided on an outer peripheral surface of the outer tube 3. The thermoelectric power generation module 5 generates thermoelectric power using the outer peripheral surface of the inner tube 4 as a low temperature source and an inner peripheral surface of the outer tube 3 as a high temperature source. The inner peripheral surface of the outer tube 3 closely contacts the outer peripheral surface of the thermoelectric power generation module 5.

Abstract: A tubular heat exchanger, with a thermoelectric power generation function, includes: a thermoelectric power generation module 2 mounted on an outer circumferential surface of the heat exhaust tube 1; and a cooling pipe 3 mounted on an outer circumferential surface of the thermoelectric power generation module 2. The cooling pipe 3 is for allowing a cooling material to flow therethrough. The thermoelectric power generation module 2 performs thermoelectric power generation by using the outer circumferential surface of the heat exhaust tube 1 as a high-temperature source and using the inner circumferential surface of the cooling pipe 3 as a low-temperature source. The cooling pipe 3 is in tight attachment to the outer circumferential surface of the thermoelectric power generation module 2.

Abstract: A cold insulation container includes: a cold insulation storage including a coolant vessel; a circulating air fan that causes cold air from the coolant vessel to circulate in the cold insulation storage; a thermoelectric generating module attached to an outer surface of the coolant vessel; and a temperature controller that adjusts a temperature in the cold insulation storage. A temperature difference between the coolant vessel and circulating cold air in the cold insulation storage causes the temperature controller and the circulating air fan to be driven by thermoelectric power generated by the thermoelectric generating module.

Abstract: In a known method in which a cooling pipe that is fixed and rigid is used, variation in a distance from the center of an exhaust heat pipe to the outer surface of a thermoelectric conversion module, variation in the radius of curvature of the curved surface of a cooling pipe, and other factors produce a gap between the outer surface of the thermoelectric conversion module and the inside surface of the cooling pipe. The gap prevents the achievement of desired cooling performance and the improvement of power generation efficiency. A thermoelectric conversion module of the present invention includes two flexible substrates each made of a thin resin film and having mounting lands formed thereon, and a plurality of thermoelectric elements mounted on the mounting lands at high density, wherein one of the two flexible substrate has a plurality of slits to make the module easy to bend.

Abstract: In a known method in which a cooling pipe that is fixed and rigid is used, variation in a distance from the center of an exhaust heat pipe to the outer surface of a thermoelectric conversion module, variation in the radius of curvature of the curved surface of a cooling pipe, and other factors produce a gap between the outer surface of the thermoelectric conversion module and the inside surface of the cooling pipe. The gap prevents the achievement of desired cooling performance and the improvement of power generation efficiency. A thermoelectric conversion module of the present invention includes two flexible substrates each made of a thin resin film and having mounting lands formed thereon, and a plurality of thermoelectric elements mounted on the mounting lands at high density, wherein one of the two flexible substrate has a plurality of slits to make the module easy to bend.

Abstract: The present invention provides an antenna in which, on a dielectric substrate 1 having a back face on which a grounding conductor plate 14 is disposed, a plurality of conductor elements 12 are arranged in a matrix of rows and columns. Each of the dielectric elements 12 has a size which cannot function as an antenna. Above the conductor elements 12, a connecting element 13 overlapping two adjacent conductor elements 12 is disposed. Among the connecting elements 13, some cause the conductor elements 12 on both sides to be in a conductive condition, and others cause the conductor elements 12 on both sides to be in a non-conductive condition. The switching between the conductive and non-conductive conditions between the conductor elements 12 can be dynamically performed by a switching element.

Abstract: A surface acoustic wave device includes a piezoelectric substrate, a first interdigital transducer and a second interdigital transducer formed on the substrate so that the first and second interdigital transducers are opposed to each other. The substrate includes a doping region that is doped with a substance in at least one form selected from the group consisting of atoms, molecules and clusters in a surface between the first and second interdigital transducers.

Abstract: An Al film is formed on a cap wafer and the Al film is patterned into a ring-shaped film. Dry etching is performed by using the ring-shaped film as a mask to form a drum portion enclosing a recess portion to provide a vacuum dome. After forming a depth of cut into the substrate portion of the cap wafer, the cap wafer is placed on a main body wafer having an infrared area sensor formed thereon. Then, the ring-shaped film of the cap wafer and the ring-shaped film of the main body wafer are joined to each other by pressure bonding to form a ring-shaped joining portion.

Abstract: The resonator of the present invention includes a cylindrical dielectric and a conductor film covering the surface of the dielectric in close contact therewith. The conductor film is constructed of a cylindrical portion and two flat portions, and is formed by subjecting the surface of the dielectric to metallization or the like. With the conductor film formed in close contact with the dielectric, deterioration of the Q value and the like caused by instability of connection at the corners can be suppressed even when a radio frequency induced current flows from the cylindrical portion over the two flat portions.

Abstract: An Al film is formed on a cap wafer and the Al film is patterned into a ring-shaped film. Dry etching is performed by using the ring-shaped film as a mask to form a drum portion enclosing a recess portion to provide a vacuum dome. After forming a depth of cut into the substrate portion of the cap wafer, the cap wafer is placed on a main body wafer having an infrared area sensor formed thereon. Then, the ring-shaped film of the cap wafer and the ring-shaped film of the main body wafer are joined to each other by pressure bonding to form a ring-shaped joining portion.

Abstract: A dielectric resonator filter comprises dielectric resonators, an enclosure having a main body, a lid, and partition walls, interstage-coupling tuning windows, interstage-coupling tuning bolts, input/output terminals, and input/output coupling probes. Resonance-frequency tuning members each composed of a conductor plate and a bolt coupled integrally thereto are attached to the enclosure lid. Undesired-mode suppressing means such as rings attached to the bolts of the resonance-frequency tuning members or bolts attached to the conductor plates or to the enclosure lid are disposed in an undesired-mode excitation space, whereby the occurrence of a disturbed characteristic in the pass band (or stop band) is suppressed.

Abstract: The present invention provides an antenna in which, on a dielectric substrate 1 having a back face on which a grounding conductor plate 14 is disposed, a plurality of conductor elements 12 are arranged in a matrix of rows and columns. Each of the dielectric elements 12 has a size which cannot function as an antenna. Above the conductor elements 12, a connecting element 13 overlapping two adjacent conductor elements 12 is disposed. Among the connecting elements 13, some cause the conductor elements 12 on both sides to be in a conductive condition, and others cause the conductor elements 12 on both sides to be in a non-conductive condition. The switching between the conductive and non-conductive conditions between the conductor elements 12 can be dynamically performed by a switching element.

Abstract: An Al film is formed on a cap wafer and the Al film is patterned into a ring-shaped film. Dry etching is performed by using the ring-shaped film as a mask to form a drum portion enclosing a recess portion to provide a vacuum dome. After forming a depth of cut into the substrate portion of the cap wafer, the cap wafer is placed on a main body wafer having an infrared area sensor formed thereon. Then, the ring-shaped film of the cap wafer and the ring-shaped film of the main body wafer are joined to each other by pressure bonding to form a ring-shaped joining portion.

Abstract: The resonator of the present invention includes a cylindrical dielectric and a conductor film covering the surface of the dielectric in close contact therewith. The conductor film is constructed of a cylindrical portion and two flat portions, and is formed by subjecting the surface of the dielectric to metallization or the like. With the conductor film formed in close contact with the dielectric, deterioration of the Q value and the like caused by instability of connection at the corners can be suppressed even when a radio frequency induced current flows from the cylindrical portion over the two flat portions.

Abstract: A dielectric resonator filter comprises dielectric resonators, an enclosure having a main body, a lid, and partition walls, interstage-coupling tuning windows, interstage-coupling tuning bolts, input/output terminals, and input/output coupling probes. Resonance-frequency tuning members each composed of a conductor plate and a bolt coupled integrally thereto are attached to the enclosure lid. Undesired-mode suppressing means such as rings attached to the bolts of the resonance-frequency tuning members or bolts attached to the conductor plates or to the enclosure lid are disposed in an undesired-mode excitation space, whereby the occurrence of a disturbed characteristic in the pass band (or stop band) is suppressed.

Abstract: The resonator of the present invention includes a cylindrical dielectric and a conductor film covering the surface of the dielectric in close contact therewith. The conductor film is constructed of a cylindrical portion and two flat portions, and is formed by subjecting the surface of the dielectric to metallization or the like. With the conductor film formed in close contact with the dielectric, deterioration of the Q value and the like caused by instability of connection at the corners can be suppressed even when a radio frequency induced current flows from the cylindrical portion over the two flat portions.

Abstract: A surface acoustic wave device includes a piezoelectric substrate, a first interdigital transducer and a second interdigital transducer formed on the substrate so that the first and second interdigital transducers are opposed to each other. The substrate includes a doping region that is doped with a substance in at least one form selected from the group consisting of atoms, molecules and clusters in a surface between the first and second interdigital transducers.