Patents by Inventor Michio Okawa

Michio Okawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6640639
    Abstract: A pressure sensor according to the present invention comprises a pressure measuring portion which is composed of a resin and contacts fluid, and a sensor element which measures pressure imposed on the pressure measuring portion. Furthermore, a conductive layer having electrical conductivity is provided between the pressure measuring portion and the sensor element, and the conductive layer is connected to a ground. According to this pressure sensor, static electricity accumulated in the pressure measuring portion is released to a ground through the conductive layer without being transmitted to the sensor element.
    Type: Grant
    Filed: August 23, 2002
    Date of Patent: November 4, 2003
    Assignee: Surpass Industry Co., Ltd.
    Inventor: Michio Okawa
  • Publication number: 20030037618
    Abstract: A pressure sensor according to the present invention comprises a pressure measuring portion which is composed of a resin and contacts fluid, and a sensor element which measures pressure imposed on the pressure measuring portion. Furthermore, a conductive layer having electrical conductivity is provided between the pressure measuring portion and the sensor element, and the conductive layer is connected to a ground. According to this pressure sensor, static electricity accumulated in the pressure measuring portion is released to a ground through the conductive layer without being transmitted to the sensor element.
    Type: Application
    Filed: August 23, 2002
    Publication date: February 27, 2003
    Applicant: Surpass Industry Co., Ltd., a Japanese Corporation
    Inventor: Michio Okawa