Abstract: A connection terminal having a copper alloy as a base material, the copper alloy comprising Zn in an amount of 21 mass % or more and 27 mass % or less, Sn in an amount of 0.6 mass % or more and 0.9 mass % or less, Ni in an amount of 2.5 mass % or more and 3.7 mass % or less, and P in an amount of 0.01 mass % or more and 0.03 mass % or less, and the balance being Cu and inevitable impurities, wherein the copper alloy has: a 0.2% proof stress of 620 MPa or higher and 700 MPa or lower, and an electrical conductivity of 15% IACS or higher and 20% IACS or lower.

Abstract: A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11?[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]?19 is satisfied, a relationship of 7?[Ni]/[P]?40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 ?m to 8.0 ?m, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t?0.

Abstract: The present invention relates to a copper alloy sheet for terminal and connector materials, which is excellent in terms of tensile strength, proof stress, Young's modulus, electric conductivity, bending workability, stress corrosion crack resistance, stress relaxation characteristics and solderability.

Abstract: A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11?[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]?19 is satisfied, a relationship of 7?[Ni]/[P]?40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 ?m to 8.0 ?m, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t?0.

Abstract: A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11?[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]?19 is satisfied, a relationship of 7?[Ni]/[P]?40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 ?m to 8.0 ?m, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t?0.

Abstract: A copper alloy sheet according to one aspect contains 28.0 mass % to 35.0 mass % of Zn, 0.15 mass % to 0.75 mass % of Sn, 0.005 mass % to 0.05 mass % of P, and a balance consisting of Cu and unavoidable impurities, in which relationships of 44?[Zn]+20×[Sn]?37 and 32?[Zn]+9×([Sn]?0.25)1/2?37 are satisfied. The copper alloy sheet according to the aspect is manufactured by a manufacturing process including a finish cold-rolling process of cold-rolling a copper alloy material, an average grain size of the copper alloy material is 2.0 ?m to 7.0 ?m, and a sum of an area ratio of a ? phase and an area ratio of a ? phase in a metallographic structure of the copper alloy material is 0% to 0.9%.

Abstract: A copper alloy sheet according to one aspect contains 28.0 mass % to 35.0 mass % of Zn, 0.15 mass % to 0.75 mass % of Sn, 0.005 mass % to 0.05 mass % of P, and a balance consisting of Cu and unavoidable impurities, in which relationships of 44?[Zn]+20×[Sn]?37 and 32?[Zn]+9×([Sn]?0.25)1/2?37 are satisfied. The copper alloy sheet according to the aspect is manufactured by a manufacturing process including a finish cold-rolling process of cold-rolling a copper alloy material, an average grain size of the copper alloy material is 2.0 ?m to 7.0 ?m, and a sum of an area ratio of a ? phase and an area ratio of a ? phase in a metallographic structure of the copper alloy material is 0% to 0.9%.

Abstract: A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11?[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]?19 is satisfied, a relationship of 7?[Ni]/[P]?40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 ?m to 8.0 ?m, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t?0.

Abstract: A copper alloy sheet according to one aspect contains 28.0 mass % to 35.0 mass % of Zn, 0.15 mass % to 0.75 mass % of Sn, 0.005 mass % to 0.05 mass % of P, and a balance consisting of Cu and unavoidable impurities, in which relationships of 44?[Zn]+20×[Sn]?37 and 32?[Zn]+9×([Sn]?0.25)1/2?37 are satisfied. The copper alloy sheet according to the aspect is manufactured by a manufacturing process including a finish cold-rolling process of cold-rolling a copper alloy material, an average grain size of the copper alloy material is 2.0 ?m to 7.0 ?m, and a sum of an area ratio of a ? phase and an area ratio of a ? phase in a metallographic structure of the copper alloy material is 0% to 0.9%.

Abstract: A copper alloy sheet according to one aspect contains 28.0 mass % to 35.0 mass % of Zn, 0.15 mass % to 0.75 mass % of Sn, 0.005 mass % to 0.05 mass % of P, and a balance consisting of Cu and unavoidable impurities, in which relationships of 44?[Zn]+20×[Sn]?37 and 32?[Zn]+9×([Sn]?0.25)1/2?37 are satisfied. The copper alloy sheet according to the aspect is manufactured by a manufacturing process including a finish cold-rolling process of cold-rolling a copper alloy material, an average grain size of the copper alloy material is 2.0 ?m to 7.0 ?m, and a sum of an area ratio of a ? phase and an area ratio of a ? phase in a metallographic structure of the copper alloy material is 0% to 0.9%.