Patents by Inventor Michio UNEDA

Michio UNEDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10464186
    Abstract: The method of the present invention comprises the steps of: previously obtaining correlation data between surface properties of the polishing pad dressed under a plurality of stages of dressing conditions and polishing effects of the work polished by the polishing pad dressed under the dressing conditions; determining an assumed dressing condition capable of achieving an object polishing effect from the correlation data; dressing the polishing pad under the assumed dressing condition determined; polishing the work; cleaning the polishing pad which has been used for polishing the work; and measuring a surface property of the cleaned polishing pad.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: November 5, 2019
    Assignees: FUJIKOSHI MACHINERY CORP., KANAZAWA INSTITUTE OF TECHNOLOGY
    Inventors: Kazutaka Shibuya, Jun Yanagisawa, Yoshio Nakamura, Michio Uneda, Kenichi Ishikawa
  • Patent number: 10449655
    Abstract: The polishing apparatus comprises: a dressing section for dressing a polishing pad; a measuring section for measuring a surface property of the polishing pad; a polishing result measuring section for measuring a polishing result of a work; a storing section for storing correlation data between dressing condition data for dressing the polishing pad, surface property of the polishing pad and polishing results, which are learned by an artificial intelligence; and an input section for inputting an object polishing result. The artificial intelligence performs a first arithmetic process, in which the surface property of the polishing pad corresponding to the object polishing result is inversely estimated on the basis of the correlation data, and a second arithmetic process, in which the corresponding dressing condition is derived on the basis of the surface property of the polishing pad inversely estimated.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: October 22, 2019
    Assignees: FUJIKOSHI MACHINERY CORP., KANAZAWA INSTITUTE OF TECHNOLOGY
    Inventors: Kazutaka Shibuya, Yoshio Nakamura, Michio Uneda, Kenichi Ishikawa
  • Publication number: 20180207768
    Abstract: The polishing apparatus comprises: a dressing section for dressing a polishing pad; a measuring section for measuring a surface property of the polishing pad; a polishing result measuring section for measuring a polishing result of a work; a storing section for storing correlation data between dressing condition data for dressing the polishing pad, surface property of the polishing pad and polishing results, which are learned by an artificial intelligence; and an input section for inputting an object polishing result. The artificial intelligence performs a first arithmetic process, in which the surface property of the polishing pad corresponding to the object polishing result is inversely estimated on the basis of the correlation data, and a second arithmetic process, in which the corresponding dressing condition is derived on the basis of the surface property of the polishing pad inversely estimated.
    Type: Application
    Filed: January 3, 2018
    Publication date: July 26, 2018
    Inventors: Kazutaka SHIBUYA, Yoshio NAKAMURA, Michio UNEDA, Kenichi ISHIKAWA
  • Publication number: 20170190018
    Abstract: The method of the present invention comprises the steps of: previously obtaining correlation data between surface properties of the polishing pad dressed under a plurality of stages of dressing conditions and polishing effects of the work polished by the polishing pad dressed under the dressing conditions; determining an assumed dressing condition capable of achieving an object polishing effect from the correlation data; dressing the polishing pad under the assumed dressing condition determined; polishing the work; cleaning the polishing pad which has been used for polishing the work; and measuring a surface property of the cleaned polishing pad.
    Type: Application
    Filed: December 29, 2016
    Publication date: July 6, 2017
    Inventors: Kazutaka SHIBUYA, Jun YANAGISAWA, Yoshio NAKAMURA, Michio UNEDA, Kenichi ISHIKAWA