Abstract: Provided is an alumina particle for use as a filler for resin compositions, which can improve the thermal conductivity of the resin composition over conventional resin compositions. It is an alumina particle having a particle diameter D50 of more than 100 ?m at a cumulative value of 50% from the fine particle side in the cumulative particle size distribution, and having an ?-alumina rate of 90% or more; wherein the ?-alumina is a monocrystalline alumina. The alumina particle preferably has a Na content of 800 ppm or less. In addition, the alumina particle preferably has a particle diameter D10 of 70 to 135 ?m at a cumulative value of 10% from the fine particle side in the cumulative particle size distribution.

Abstract: The present invention provides a cured film of a mixed composition of an organosilicon compound (A) including a fluoropolyether structure and an organosilicon compound (C) having an amino group or an amine skeleton, in which, when the elements constituting one side surface (W) of the cured film and amounts thereof are measured by X-ray photoelectron spectroscopy (XPS), the cured film has an F content of 60 atom % or more and an O content of 17 atom % or more.

Abstract: The present invention provides a mixed composition of an organosilicon compound (C) having an amino group or an amine skeleton, a solvent 1, and a solvent 2, in which, when the ratio of the hydrogen bond term (?H) to the dispersion term (?D) in the Hansen solubility parameters is defined as ?H/?D, the ratio (?H/?D) for the solvent 1 is less than 0.410 and the ratio (?H/?D) for the solvent 2 is 0.410 or more.

Abstract: To provide a mixed composition which is capable of forming a film excellent in liquid-repellent property (water-repellent property in particular) and furthermore which is excellent in storage stability and is capable of forming a film excellent in liquid-repellent property (water-repellent property in particular) even if stored for a long period of time and then formed into a film. To further provide a film obtained by curing the mixed composition, and glass having the film. A mixed composition of a compound (A1) represented by formula (a1), an organosilicon compound (B) represented by formula (b1), and a solvent (E), wherein the solvent (E) comprises a compound (E1) satisfying a Hansen solubility parameter of 18 (J/cm3)1/2 or more and 23.5 (J/cm3)1/2 or less and a hydrogen bonding term (?H) of the Hansen solubility parameter, of 5.5 (J/cm3)1/2 or more.

Abstract: A curable composition comprising a condensate having an alkyl group having 6 to 30 carbon atoms, wherein the curable composition has at least one peak with a concentration fraction of 250000 or more in a range where the molecular weight in terms of standard polyethylene glycol is 500 or more and 2000 or less in a differential molecular weight distribution curve determined from a chromatogram obtained by GPC chromatography.

Abstract: A mixed composition of a compound (A1) represented by formula (a1), an organosilicon compound (B) represented by formula (b1), and an organosilicon compound (C) represented by formula (c1), wherein the mass ratio [A1/(B+C)] of the compound (A1) to the total amount of the organosilicon compound (B) and the organosilicon compound (C) is 0.060 or more.