Patents by Inventor Michitaka Hattori

Michitaka Hattori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9011750
    Abstract: The injection molding device of the present invention is provided with a supply pipe which supplies a heat medium to a mold, a discharge pipe which discharges the heat medium from the mold, a mold temperature adjustor to which the supply pipe and the discharge pipe are connected to adjust the temperature of the mold, and a discharge rate adjusting unit which is provided with a variable flow control valve installed on the discharge pipe to adjust a flow rate of the heat medium, a discharge pipe variable flow control valve bypass pipe for bypassing the variable flow control valve and a discharge pipe bypass on-off valve installed on the bypass pipe to change a flow rate of the heat medium and which is installed at a position upstream from the mold temperature adjustor on the discharge pipe.
    Type: Grant
    Filed: April 21, 2010
    Date of Patent: April 21, 2015
    Assignee: Mitsubishi Heavy Industries Plastic Technology Co., Ltd.
    Inventors: Michitaka Hattori, Satoshi Imaeda, Toshihiko Kariya
  • Patent number: 8460586
    Abstract: An injection molding device is provided with a mold, an injection unit equipped with an injection screw that is displaceably configured such that a molten resin is filled into a cavity by forward movement to perform plural injection operations including at least a filling operation and a pressure keeping operation by displacing the injection screw, a position sensor for detecting the position of the injection screw, a temperature sensor capable of measuring the temperature of the vicinity of the cavity of the mold, a temperature adjustment unit capable of adjusting the temperature of the mold by heating or cooling the mold, a control unit for controlling the displacement of the injection screw and the temperature of the mold and determining plural switching timings of the injection operations on the basis of the position of the screw, and a display unit for displaying an image.
    Type: Grant
    Filed: April 15, 2009
    Date of Patent: June 11, 2013
    Assignee: Mitsubishi Heavy Industries Plastics Technology Co., Ltd.
    Inventors: Toshihiko Kariya, Michitaka Hattori, Shigeru Nozaki, Satoshi Imaeda
  • Patent number: 8360766
    Abstract: An injection molding machine is provided with a mold forming a cavity into which a resin is injected, a liquid supplying device which supplies a liquid continuously to an internal flow channel of the mold during a preparation period prior to injection of the resin and an injection period in which the resin after the preparation period is injected, an electricity supplying device which supplies electricity to an electric heater arranged on the mold at least during a part of the preparation period, thereby heating the mold, and a controller which carries out a predetermined procedure for making different a temperature of a liquid in the internal flow channel between the preparation period and the injection period.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: January 29, 2013
    Assignee: Mitsubishi Heavy Industries Plastic Technology Co., Ltd.
    Inventors: Toshihiko Kariya, Satoshi Miyagawa, Naoki Toda, Gen Hamada, Michitaka Hattori
  • Patent number: 8318061
    Abstract: In a mold temperature control circuit of an injection molding device, such a molding cycle is repeated that, prior to injection of a resin, a heating-use medium is returned to molds and heated to a temperature suitable for resin injection, after injection of the resin, the heating-use medium is switched to a cooling-use medium, thereby the cooling-use medium is returned to the molds and cooling is conducted to give a temperature equal to or lower than a temperature at which the resin is solidified.
    Type: Grant
    Filed: June 29, 2009
    Date of Patent: November 27, 2012
    Assignee: Mitsubishi Heavy Industries Plastic Technology Co., Ltd.
    Inventors: Michitaka Hattori, Satoshi Imaeda, Toshihiko Kariya
  • Publication number: 20120241125
    Abstract: The injection molding device of the present invention is provided with a supply pipe which supplies a heat medium to a mold, a discharge pipe which discharges the heat medium from the mold, a mold temperature adjustor to which the supply pipe and the discharge pipe are connected to adjust the temperature of the mold, and a discharge rate adjusting unit which is provided with a variable flow control valve installed on the discharge pipe to adjust a flow rate of the heat medium, a discharge pipe variable flow control valve bypass pipe for bypassing the variable flow control valve and a discharge pipe bypass on-off valve installed on the bypass pipe to change a flow rate of the heat medium and which is installed at a position upstream from the mold temperature adjustor on the discharge pipe.
    Type: Application
    Filed: April 21, 2010
    Publication date: September 27, 2012
    Applicant: MITSUBISHI HEAVY INDUSTRIES PLASTIC TECHNOLOGY CO., LTD.
    Inventors: Michitaka Hattori, Satoshi Imaeda, Toshihiko Kariya
  • Patent number: 8043537
    Abstract: There are provided an injection molding system, a computer program, a method of injection molding, and an injection molding machine capable of performing precise temperature control of a mold even when there is a delay in temperature increase of the mold in heat supply with a heating medium. The temperature control is performed so that temperatures of a fixed mold and a movable mold are maintained between an upper limit TU and a lower limit TL of a predetermined temperature range after start of injection of resin during an injection molding cycle. The temperature control of the fixed mold and the movable mold is performed only by switching ON/OFF supply of the heating medium, and cooling with a cooling medium is not performed.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: October 25, 2011
    Assignee: Mitsubishi Heavy Industries Plastics Technology Co., Ltd.
    Inventors: Yoshio Shikase, Michitaka Hattori, Shigeru Nozaki, Satoshi Imaeda, Toshihiko Kariya
  • Patent number: 8043538
    Abstract: In a mold temperature control circuit of an injection molding device, such a molding cycle is repeated that, prior to injection of a resin, a heating-use medium is returned to molds and heated to a temperature suitable for resin injection, after injection of the resin, the heating-use medium is switched to a cooling-use medium, thereby the cooling-use medium is returned to the molds and cooling is conducted to give a temperature equal to or lower than a temperature at which the resin is solidified.
    Type: Grant
    Filed: June 29, 2009
    Date of Patent: October 25, 2011
    Assignee: Mitsubishi Heavy Industries Plastic Technology Co., Ltd.
    Inventors: Michitaka Hattori, Satoshi Imaeda, Toshihiko Kariya
  • Publication number: 20110210461
    Abstract: An injection molding device is provided with a mold, an injection unit equipped with an injection screw that is displaceably configured such that a molten resin is filled into a cavity by forward movement to perform plural injection operations including at least a filling operation and a pressure keeping operation by displacing the injection screw, a position sensor for detecting the position of the injection screw, a temperature sensor capable of measuring the temperature of the vicinity of the cavity of the mold, a temperature adjustment unit capable of adjusting the temperature of the mold by heating or cooling the mold, a control unit for controlling the displacement of the injection screw and the temperature of the mold and determining plural switching timings of the injection operations on the basis of the position of the screw, and a display unit for displaying an image.
    Type: Application
    Filed: April 15, 2009
    Publication date: September 1, 2011
    Applicant: Mitsubishi Heavy Industries Plastic Technology Co. Ltd.
    Inventors: Toshihiko Kariya, Michitaka Hattori, Shigeru Nozaki, Satoshi Imaeda
  • Publication number: 20110115120
    Abstract: In a mold temperature control circuit of an injection molding device, such a molding cycle is repeated that, prior to injection of a resin, a heating-use medium is returned to molds and heated to a temperature suitable for resin injection, after injection of the resin, the heating-use medium is switched to a cooling-use medium, thereby the cooling-use medium is returned to the molds and cooling is conducted to give a temperature equal to or lower than a temperature at which the resin is solidified.
    Type: Application
    Filed: June 29, 2009
    Publication date: May 19, 2011
    Applicant: Mitsubishi Heavy Industries Plastic Technology Co. Ltd.
    Inventors: Michitaka Hattori, Satoshi Imaeda, Toshihiko Kariya
  • Publication number: 20110049762
    Abstract: An injection molding machine is provided with a mold forming a cavity into which a resin is injected, a liquid supplying device which supplies a liquid continuously to an internal flow channel of the mold during a preparation period prior to injection of the resin and an injection period in which the resin after the preparation period is injected, an electricity supplying device which supplies electricity to an electric heater arranged on the mold at least during a part of the preparation period, thereby heating the mold, and a controller which carries out a predetermined procedure for making different a temperature of a liquid in the internal flow channel between the preparation period and the injection period.
    Type: Application
    Filed: August 5, 2009
    Publication date: March 3, 2011
    Applicant: MITSUBISHI HEAVY INDUSTRIES PLASTIC TECHNOLOGY Co., Ltd.
    Inventors: Toshihiko Kariya, Satoshi Miyagawa, Naoki Toda, Gen Hamada, Michitaka Hattori
  • Publication number: 20100044900
    Abstract: There are provided an injection molding system, a computer program, a method of injection molding, and an injection molding machine capable of performing precise temperature control of a mold even when there is a delay in temperature increase of the mold in heat supply with a heating medium. The temperature control is performed so that temperatures of a fixed mold and a movable mold are maintained between an upper limit TU and a lower limit TL of a predetermined temperature range after start of injection of resin during an injection molding cycle. The temperature control of the fixed mold and the movable mold is performed only by switching ON/OFF supply of the heating medium, and cooling with a cooling medium is not performed.
    Type: Application
    Filed: October 31, 2007
    Publication date: February 25, 2010
    Applicant: MITSUBISHI HEAVY INDUSTRIES PLASTIC TECHNOLOGY CO
    Inventors: Yoshio Shikase, Michitaka Hattori, Shigeru Nozaki, Satoshi Imaeda, Toshihiko Kariya