Patents by Inventor Michitaka Okazaki

Michitaka Okazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220148796
    Abstract: Disclosed herein is a composite electronic component that includes: a first coil pattern formed on at least a first conductor layer, the first coil pattern having one end coupled to the first terminal electrode and other end coupled to the second terminal electrode; a second coil pattern formed on at least a second conductor layer; a third coil pattern formed on at least the first and second conductor layers, the third coil pattern having one end coupled to the one end of the second coil pattern and other end coupled to the third terminal electrode; and a fourth coil pattern formed on at least the first and second conductor layers, the fourth coil pattern having one end coupled to the other end of the second coil pattern and other end coupled to the fourth terminal electrode.
    Type: Application
    Filed: October 21, 2021
    Publication date: May 12, 2022
    Applicant: TDK CORPORATION
    Inventors: Tomonaga NISHIKAWA, Keigo Higashida, Masaki Yoneyama, Michitaka Okazaki, Masumi Kameda
  • Patent number: 10225923
    Abstract: Disclosed herein is an electronic circuit module that includes a substrate having a power supply pattern, an electronic component mounted on a front surface of the substrate, a molding resin that covers the front surface of the substrate so as to embed the electronic component therein, a metal shield covering the molding resin, and a through conductor formed so as to penetrate through the molding resin to connect the metal shield to the power supply pattern.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: March 5, 2019
    Assignee: TDK CORPORATION
    Inventors: Yoshihiro Suzuki, Tomohide Yokozawa, Michitaka Okazaki, Takuro Aoki, Masashi Katsumata
  • Publication number: 20170295643
    Abstract: Disclosed herein is an electronic circuit module that includes a substrate having a power supply pattern, an electronic component mounted on a front surface of the substrate, a molding resin that covers the front surface of the substrate so as to embed the electronic component therein, a metal shield covering the molding resin, and a through conductor formed so as to penetrate through the molding resin to connect the metal shield to the power supply pattern.
    Type: Application
    Filed: April 4, 2017
    Publication date: October 12, 2017
    Applicant: TDK Corporation
    Inventors: Yoshihiro SUZUKI, Tomohide Yokozawa, Michitaka Okazaki, Takuro Aoki, Masashi Katsumata