Abstract: An electronic component embedded substrate includes conductor layers L1 to L3, insulating layers 112 and 113 provided between the conductor layers L2 and L3, an insulating layer 114 provided between the conductor layers L1 and L2, a semiconductor embedded in the insulating layers 112 and 113, a via conductor 142 filling a via V, and a via conductor 143 filling a via 143a. The via 143a is provided at such a position that overlaps the via V and is shallower than the via V. The inner wall of the via 143a is larger in surface roughness than the inner wall of the via V. This makes voids less likely to occur in the via conductor 142 filling the deep via V and enhances adhesion between the via conductor 143 and the shallow via 143a that the via conductor 143 fills.

Abstract: Disclosed herein is a composite electronic component that includes: a first coil pattern formed on at least a first conductor layer, the first coil pattern having one end coupled to the first terminal electrode and other end coupled to the second terminal electrode; a second coil pattern formed on at least a second conductor layer; a third coil pattern formed on at least the first and second conductor layers, the third coil pattern having one end coupled to the one end of the second coil pattern and other end coupled to the third terminal electrode; and a fourth coil pattern formed on at least the first and second conductor layers, the fourth coil pattern having one end coupled to the other end of the second coil pattern and other end coupled to the fourth terminal electrode.

Abstract: Disclosed herein is an electronic circuit module that includes a substrate having a power supply pattern, an electronic component mounted on a front surface of the substrate, a molding resin that covers the front surface of the substrate so as to embed the electronic component therein, a metal shield covering the molding resin, and a through conductor formed so as to penetrate through the molding resin to connect the metal shield to the power supply pattern.

Abstract: Disclosed herein is an electronic circuit module that includes a substrate having a power supply pattern, an electronic component mounted on a front surface of the substrate, a molding resin that covers the front surface of the substrate so as to embed the electronic component therein, a metal shield covering the molding resin, and a through conductor formed so as to penetrate through the molding resin to connect the metal shield to the power supply pattern.