Abstract: A temperature control apparatus for controlling a temperature of an electronic device operating with a power supply from a power supply unit, the temperature control apparatus includes a thermoelectric element configured to be serially connected between the power supply unit and the electronic device, and provided at a position where heat generated by the electronic device is transmitted so as to perform a temperature control over the electronic device with the power supplied from the power supply unit.

Abstract: According to a water pillow for heat radiation for touching a heat generating object, absorbing heat from the heat generating object and radiating heat by cooling liquid that circulates inside the water pillow, said device includes an inflow inlet for flowing the cooling liquid inside the water pillow, a drain outlet for flowing the cooling liquid out of inside the water pillow, a plurality of cooling fins spoke wise disposed on a first plane constituting a cavity inside the water pillow where the cooling liquid circulates and an impeller for circulating in a whirl the cooling liquid disposed on a second plane opposed in parallel or almost parallel with the first plane.

Abstract: A socket for mounting an IC device having an opening formed in the socket body is disclosed. At least a probe in electrical contact with the IC device is partly exposed to the opening and cooled by cooling air passing through the opening.