Abstract: A plunger is used for a multi-plunger type resin mold device which is adapted to be slidably inserted into a pot to permit a resin in the pot into a mold. The plunger includes a forward end member whose forward end edge portion is formed of silicon nitride, silicon carbide or zirconia, the forward end edge portion of said forward end pot member being in contact with the resin in the pot, and a plunger body to which the forward end member is fixed. The forward end member is fixed to the plunger body by threadably inserting an insertion section of the forward end member into a recess formed in the plunger body.

Abstract: A high-density resin tablet and a method for encapsulating semiconductor devices using the same, by which molded products free from voids may be obtained. The high-density resin tablet of the present invention may be obtained by compressing a thermosetting resin such as an epoxy resin at a pressure of 4 ton/cm.sup.2 or more, and has a compressibility of 95% or more. The tablet of the present invention may be used in the same manner as the conventional tablets in multitablet molding and transfer molding method.

Abstract: A molding machine for encapsulation including a transfer molding die provided with a plurality of pots which comprises a transfer molding press, a molding die including a plurality of pots allowing for the passage of plungers integrally formed with the rods of the cylinders, a plurality of runners branched off from the pots, a plurality of cavities connected to the runners through the corresponding gates, and displacement transducers for detecting the rate of the displacement of the plungers, variable flow rate control valves communicating with lines connected to the cylinders, and a control circuit for controlling the operation of the variable flow rate control valve in accordance with output signals from the displacement transducers, thereby causing the plungers corresponding to cylinders to be moved exactly at the same speed.