Patents by Inventor Michiya Higuchi
Michiya Higuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10527937Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ?-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25° C., and a second ?-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25° C.Type: GrantFiled: November 7, 2017Date of Patent: January 7, 2020Assignee: GOO CHEMICAL CO., LTD.Inventors: Yoshio Sakai, Nobuhito Hamada, Michiya Higuchi, Tokuzan Miyake
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Patent number: 10317796Abstract: A solder resist composition includes: a carboxyl group-containing resin; a photopolymerizable compound; a photopolymerization initiator containing a bisacylphosphine oxide-based photopolymerization initiator and an ?-hydroxy alkylphenone-based photopolymerization initiator; and a fluorescent dye. The bisacylphosphine oxide-based photopolymerization initiator contains bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide. The ?-hydroxy alkylphenone-based photopolymerization initiator contains 2-hydroxy-2-methyl-1-phenyl-propane-1-one. A mass ratio of the bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide to the 2-hydroxy-2-methyl-1-phenyl-propane-1-one is 2:1 to 1:10.Type: GrantFiled: December 10, 2014Date of Patent: June 11, 2019Assignee: GOO CHEMICAL CO., LTD.Inventors: Michiya Higuchi, Yoshio Sakai, Nobuhito Hamada, Tokuzan Miyake
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Patent number: 10234758Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, a titanium dioxide, and a compound having a cyclic ether skeleton. The titanium dioxide contains both of a rutile titanium dioxide manufactured by a sulfuric acid method and a rutile titanium dioxide manufactured by a chlorine method.Type: GrantFiled: December 10, 2014Date of Patent: March 19, 2019Assignee: GOO CHEMICAL CO., LTD.Inventors: Yoshio Sakai, Michiya Higuchi, Nobuhito Hamada, Tokuzan Miyake
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Patent number: 10151976Abstract: A solder resist composition includes: (A) a carboxyl group-containing resin; (B) an epoxy compound; (C) titanium dioxide; (D) a photopolymerization initiator; and (E) an antioxidant. The component (B) contains a hydroquinone epoxy compound represented by following formula (1). The component (D) contains (D1) a bisacylphosphine oxide-based photopolymerization initiator and (D2) an ?-hydroxy alkylphenone-based photopolymerization initiator.Type: GrantFiled: August 17, 2015Date of Patent: December 11, 2018Assignee: GOO CHEMICAL CO., LTD.Inventors: Yoshio Sakai, Michiya Higuchi
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Publication number: 20180210336Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, a titanium dioxide, and a compound having a cyclic ether skeleton. The titanium dioxide contains both of a rutile titanium dioxide manufactured by a sulfuric acid method and a rutile titanium dioxide manufactured by a chlorine method.Type: ApplicationFiled: December 10, 2014Publication date: July 26, 2018Inventors: Yoshio Sakai, Michiya Higuchi, Nobuhito Hamada, Tokuzan Miyake
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Publication number: 20180059544Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ?-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25° C., and a second ?-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25° C.Type: ApplicationFiled: November 7, 2017Publication date: March 1, 2018Inventors: Yoshio Sakai, Nobuhito Hamada, Michiya Higuchi, Tokuzan Miyake
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Patent number: 9835944Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ?-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25° C., and a second ?-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25° C.Type: GrantFiled: December 10, 2014Date of Patent: December 5, 2017Assignee: GOO CHEMICAL CO., LTD.Inventors: Yoshio Sakai, Nobuhito Hamada, Michiya Higuchi, Tokuzan Miyake
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Publication number: 20170336708Abstract: A solder resist composition includes: (A) a carboxyl group-containing resin; (B) an epoxy compound; (C) titanium dioxide; (D) a photopolymerization initiator; and (E) an antioxidant. The component (B) contains a hydroquinone epoxy compound represented by following formula (1). The component (D) contains (D1) a bisacylphosphine oxide-based photopolymerization initiator and (D2) an ?-hydroxy alkylphenone-based photopolymerization initiator.Type: ApplicationFiled: August 17, 2015Publication date: November 23, 2017Inventors: Yoshio Sakai, Michiya Higuchi
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Publication number: 20170315443Abstract: A liquid solder resist composition contains: a carboxyl group-containing resin; a photopolymerizable compound which contains one or more kinds of compounds selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer; a photopolymerization initiator; an epoxy compound; and titanium dioxide. The carboxyl group-containing resin is obtained by polymerization of a monomer composition which contains: a carboxyl group-containing monomer represented by following formula (1); and a maleimide compound represented by following formula (2). The carboxyl group-containing resin does not contain a photopolymerizable functional group. In the formula (1), X represents Ra—COO.Type: ApplicationFiled: December 10, 2014Publication date: November 2, 2017Applicant: GOO CHEMICAL CO., LTD.Inventors: Nobuhito Hamada, Yoshio Sakai, Michiya Higuchi, Tokuzan Miyake
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Publication number: 20170269477Abstract: A solder resist composition includes: a carboxyl group-containing resin; a photopolymerizable compound; a photopolymerization initiator containing a bisacylphosphine oxide-based photopolymerization initiator and an ?-hydroxy alkylphenone-based photopolymerization initiator; and a phosphorescent dye. The bisacylphosphine oxide-based photopolymerization initiator contains bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide. The ?-hydroxy alkylphenone-based photopolymerization initiator contains 2-hydroxy-2-methyl-1-phenyl-propane-1-one. A mass ratio of the bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide to the 2-hydroxy-2-methyl-1-phenyl-propane-1-one is 2:1 to 1:10.Type: ApplicationFiled: December 10, 2014Publication date: September 21, 2017Inventors: Michiya Higuchi, Yoshio Sakai, Nobuhito Hamada, Tokuzan Miyake
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Publication number: 20160342085Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ?-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25° C., and a second ?-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25° C.Type: ApplicationFiled: December 10, 2014Publication date: November 24, 2016Applicant: Goo Chemical Co., Ltd.Inventors: Yoshio Sakai, Nobuhito Hamada, Michiya Higuchi, Tokuzan Miyake
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Patent number: 9458284Abstract: The carboxyl-containing resin in accordance with the present invention has a structure resulting from addition of a carboxylic acid to at least one of epoxy groups of a biphenyl novolac epoxy resin. The carboxylic acid includes at least a polybasic acid.Type: GrantFiled: November 13, 2012Date of Patent: October 4, 2016Assignee: GOO CHEMICAL CO., LTD.Inventors: Michiya Higuchi, Hisashi Marusawa, Fumito Suzuki, Yoshio Sakai
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Patent number: 9128375Abstract: The present invention provides a resin composition for resist to be efficiently formed into a cured product with high properties of crack resistance, bulge resistance, protrusion resistance, and the like for filling a through-hole, a via hole, or the like with the cured product. The resin composition for masks in accordance with the present invention contains a first resin and a second resin. The first resin is prepared by an addition reaction of polybasic acid anhydride with an adduct of an ethylenically unsaturated compound having a carboxyl group and bifunctional epoxy resin. The second resin having; a group obtained by an addition reaction of an epoxy group with monocarboxylic acid; and a group obtained by addition reaction of an epoxy group with polybasic acid.Type: GrantFiled: June 20, 2012Date of Patent: September 8, 2015Assignee: GOO CHEMICAL CO., LTD.Inventors: Michiya Higuchi, Fumito Suzuki, Yoshio Sakai, Hisashi Marusawa
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Publication number: 20140308613Abstract: The carboxyl-containing resin in accordance with the present invention has a structure resulting from addition of a carboxylic acid to at least one of epoxy groups of a biphenyl novolac epoxy resin. The carboxylic acid includes at least a polybasic acid.Type: ApplicationFiled: November 13, 2012Publication date: October 16, 2014Applicant: Goo Chemical Co., Ltd.Inventors: Michiya Higuchi, Hisashi Marusawa, Fumito Suzuki, Yoshio Sakai
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Publication number: 20140186766Abstract: The present invention provides a resin composition for resist to be efficiently formed into a cured product with high properties of crack resistance, bulge resistance, protrusion resistance, and the like for filling a through-hole, a via hole, or the like with the cured product. The resin composition for masks in accordance with the present invention contains a first resin and a second resin. The first resin is prepared by an addition reaction of polybasic acid anhydride with an adduct of an ethylenically unsaturated compound having a carboxyl group and bifunctional epoxy resin. The second resin having; a group obtained by an addition reaction of an epoxy group with monocarboxylic acid; and a group obtained by addition reaction of an epoxy group with polybasic acid.Type: ApplicationFiled: June 20, 2012Publication date: July 3, 2014Inventors: Michiya Higuchi, Fumito Suzuki, Yoshio Sakai, Hisashi Marusawa
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Patent number: 8148047Abstract: A carboxyl resin according to the present invention is obtained by a process including following steps: epoxy groups on a resin (a) having two or more epoxy groups in one molecule is made to react with 0.3-0.85 mol of a monocarboxylic acid (b) per one epoxy-group equivalent weight to obtain a reaction product (c); the epoxy group or groups on the reaction product (c) are made to react with 0.15-0.95 mol of a polybasic acid (d) per one epoxy-group equivalent weight to obtain a reaction product (e); and the epoxy group or groups on the reaction product (e) are further made to react with 1.0-5.0 mol of a monocarboxylic acid (f) per one epoxy-group equivalent weight. The carboxyl resin thus obtained has an acid value within a range from 20 to 200 mgKOH/g and is soluble in an organic solvent.Type: GrantFiled: February 20, 2009Date of Patent: April 3, 2012Assignee: Goo Chemical Company, Ltd.Inventors: Koichi Ikegami, Noboru Kohiyama, Teppei Nishikawa, Michiya Higuchi, Nobuhito Hamada, Hiroko Daido, Chieko Inui, Tatsuya Kubo
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Publication number: 20110082229Abstract: A carboxyl resin according to the present invention is obtained by a process including following steps: epoxy groups on a resin (a) having two or more epoxy groups in one molecule is made to react with 0.3-0.85 mol of a monocarboxylic acid (b) per one epoxy-group equivalent weight to obtain a reaction product (c); the epoxy group or groups on the reaction product (c) are made to react with 0.15-0.95 mol of a polybasic acid (d) per one epoxy-group equivalent weight to obtain a reaction product (e); and the epoxy group or groups on the reaction product (e) are further made to react with 1.0-5.0 mol of a monocarboxylic acid (f) per one epoxy-group equivalent weight. The carboxyl resin thus obtained has an acid value within a range from 20 to 200 mgKOH/g and is soluble in an organic solvent.Type: ApplicationFiled: February 20, 2009Publication date: April 7, 2011Applicant: GOO CHEMICAL CO., LTD.Inventors: Koichi Ikegami, Noboru Kohiyama, Teppei Nishikawa, Michiya Higuchi, Nobuhito Hamada, Hiroko Daido, Chieko Inui, Tatsuya Kubo