Abstract: To suppress cracks generated by a change in environmental temperature in a sensor body of a touch sensor that includes a light-transmissive resin film substantially made of a cycloolefin-based resin. A liquid optically clear adhesive layer is an adhesive layer including a cured body of an adhesive adhering to a glass plate that is a solid member. A sensor body having a film shape firmly adheres to the glass plate by the liquid optically clear adhesive layer, and detects a position of a contact point on a display area. A light-transmissive resin film of the sensor body is substantially made of a cycloolefin-based resin. A buffer layer having viscoelasticity at 25° C. is provided between the light-transmissive resin film and the liquid optically clear adhesive layer to relieve stress transferred from the liquid optically clear adhesive layer to the light-transmissive resin film.

Abstract: To suppress cracks generated by a change in environmental temperature in a sensor body of a touch sensor that includes a light-transmissive resin film substantially made of a cycloolefin-based resin. A liquid optically clear adhesive layer is an adhesive layer including a cured body of an adhesive adhering to a glass plate that is a solid member. A sensor body having a film shape firmly adheres to the glass plate by the liquid optically clear adhesive layer, and detects a position of a contact point on a display area. A light-transmissive resin film of the sensor body is substantially made of a cycloolefin-based resin. A buffer layer having viscoelasticity at 25° C. is provided between the light-transmissive resin film and the liquid optically clear adhesive layer to relieve stress transferred from the liquid optically clear adhesive layer to the light-transmissive resin film.

Abstract: The present invention is an electrode material constituting a movable electrode of a thermal fuse, having a five-layer clad structure including a core material layer, an intermediate layer formed on the both sides of the core material layer, and a surface layer formed on the intermediate layer, wherein the core material layer includes Cu, the intermediate layer includes an Ag—Cu-based alloy, the surface layer includes an Ag—CuO-based oxide-dispersed strengthened alloy, and the ratio of the thickness of the intermediate layer to the thickness of the surface layer (intermediate layer/surface layer) is 0.2 or more and 1.0 or less. This electrode material can be manufactured by partially internally oxidizing a three-layer clad material in which plate materials made of an Ag—Cu-based alloy are clad-jointed to both sides of the plate material made of Cu.

Abstract: A semiconductor device includes a stacked via structure including a plurality of first vias formed over a substrate, a first interconnect formed on the plurality of first vias, a plurality of second vias formed on the first interconnect, and a second interconnect formed on the plurality of second vias. One of the first vias closest to one end part of the first interconnect and one of the second vias closest to the one end part of the first interconnect at least partially overlap with each other as viewed in the plane, and the first interconnect has a first extension part extending from a position of an end of the first via toward the one end part of the first interconnect and having a length which is more than six times as long as a via width of the first via.

Abstract: The present invention is an electrode material constituting a movable electrode of a thermal fuse, having a five-layer clad structure including a core material layer, an intermediate layer formed on the both sides of the core material layer, and a surface layer formed on the intermediate layer, wherein the core material layer includes Cu, the intermediate layer includes an Ag—Cu-based alloy, the surface layer includes an Ag—CuO-based oxide-dispersed strengthened alloy, and the ratio of the thickness of the intermediate layer to the thickness of the surface layer (intermediate layer/surface layer) is 0.2 or more and 1.0 or less. This electrode material can be manufactured by partially internally oxidizing a three-layer clad material in which plate materials made of an Ag—Cu-based alloy are clad-jointed to both sides of the plate material made of Cu.