Patents by Inventor Michiya YOKOTA

Michiya YOKOTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240051068
    Abstract: A transfer apparatus includes the first plate-like member in which the micro structures are detachably held via the temporary adhesion layer, the second plate-like member having a sticky layer which faces the first plate-like member and is elastically deformable in a thickness direction, a pressure part which presses one of the first plate-like member and the second plate-like member toward another one of the first plate-like member and the second plate-like member in the thickness direction such that the temporary adhesion layer and the sticky layer become parallel to each other at least locally, a denaturing/peeling part which changes properties of the temporary adhesion layer such that an adhesive force of the temporary adhesion layer is reduced, and a controlling part which controls operations of the pressure part and the denaturing/peeling part.
    Type: Application
    Filed: April 30, 2021
    Publication date: February 15, 2024
    Applicant: SHIN-ETSU ENGINEERING CO., LTD.
    Inventors: Yoshikazu OHTANI, Michiya YOKOTA, Ryouichi INABA