Patents by Inventor Michiyoshi Izawa

Michiyoshi Izawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8546937
    Abstract: A semiconductor devices includes a first die pad having the conductivity connected to one end of a DC power source, a second die pad having the conductivity connected to the other end of the DC power source, a first switching element provided on the first die pad, receiving DC power from the DC power source via the first die pad, and having a terminal opposite to the first die pad connected to a first output terminal, and a second switching element provided on the second die pad, receiving the DC power from the DC power source via the second die pad, and connected to the first output terminal, and having a terminal opposite to the second die pad.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: October 1, 2013
    Assignee: Sanken Electric Co., Ltd.
    Inventors: Osamu Machida, Michiyoshi Izawa
  • Publication number: 20110233758
    Abstract: A semiconductor devices includes a first die pad having the conductivity connected to one end of a DC power source, a second die pad having the conductivity connected to the other end of the DC power source, a first switching element provided on the first die pad, receiving DC power from the DC power source via the first die pad, and having a terminal opposite to the first die pad connected to a first output terminal, and a second switching element provided on the second die pad, receiving the DC power from the DC power source via the second die pad, and connected to the first output terminal, and having a terminal opposite to the second die pad.
    Type: Application
    Filed: February 23, 2011
    Publication date: September 29, 2011
    Applicant: Sanken Electric Co., Ltd.
    Inventors: Osamu MACHIDA, Michiyoshi Izawa