Patents by Inventor Michiyoshi Kurosawa

Michiyoshi Kurosawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210141325
    Abstract: A silicone sponge roller for a fixing device, includes a roller substrate, a silicone sponge layer formed on the roller substrate, and a surface layer including formed of a fluorocarbon resin formed on the silicone sponge layer. The silicone sponge layer is a foam including a silicone rubber and air bubbles formed from microballoons scattered in the silicone rubber. The silicone sponge layer includes air permeating through holes aligned along the axis direction of the roller substrate, opening to both end surfaces of the silicone sponge layer. The air bubbles exist in the periphery of the through holes, and at least a part thereof is positioned in the inner surface of the through hole.
    Type: Application
    Filed: November 10, 2020
    Publication date: May 13, 2021
    Inventors: Michiyoshi KUROSAWA, Shigeto TSUDA, Kyohei EBATA
  • Patent number: 5639549
    Abstract: Disclosed is a fixing roll, comprising a core metal, a heat resistant elastic layer formed to cover the circumferential outer surface of the core metal, and a surface layer formed to cover the circumferential outer surface of the heat resistant elastic layer, the surface layer being formed of a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer resin film of a double layer structure consisting of an inner layer having a volume resistivity of 10.sup.11 .OMEGA..cm or less and an outer layer having a thickness falling within a range of between 3 .mu.m and 50 .mu.m, and the entire thickness of the resin film falling within a range of between 20 .mu.m and 500 .mu.m.
    Type: Grant
    Filed: May 8, 1992
    Date of Patent: June 17, 1997
    Assignee: Kinyosha Co., Ltd.
    Inventors: Noritomo Fukunaga, Michiyoshi Kurosawa