Abstract: This rotary device comprises a rotary stage detachably supporting a base material having an inlet and an outlet for a liquid at a predetermined temperature, and a flow path connecting the inlet to the outlet, a rotary support which supports a rotary stage, a rotary mechanism which rotates the rotary stage around the rotary support, and a liquid supply part which supplies the liquid to the base material. The rotary stage has a liquid supply port for supplying the liquid to the base material, and a liquid discharge port for discharging the liquid from the base material. The rotary support has therein a first pipe connected to the liquid supply port, and a second pipe connected to the liquid discharge port. In addition, the thermal spraying apparatus comprises the rotary device and a thermal spray gun.

Abstract: According to an embodiment of the present invention, a thermal spraying equipment including a thermal spraying machine including a thermal spraying torch thermally spraying a material onto a base material, a thermal spraying booth where thermal spraying machine is arranged, one or more peripheral devices used with the thermal spraying machine, a safety door separating an inside and an outside of the thermal spraying booth, and a centralized control board arranged outside of the thermal spraying booth, the centralized control board enabling centralized operation of the thermal spraying machine and the one or more peripheral devices. The centralized control board controls the spraying machine not to be driven in the case where the safety door is not locked normally.

Abstract: A laminate structure of the disclosure is a laminate structure for a semiconductor manufacturing device, and includes a substrate containing aluminum and including a first face, an intermediate layer arranged on the first face of the substrate and containing aluminum oxide, and a cover layer arranged on the intermediate layer and containing metal atoms. The intermediate layer includes a partition wall forming a plurality of voids in a cross-sectional shape parallel to the first face. The intermediate layer includes a boundary layer covering the first face of the substrate. The cover layer is arranged in some of the plurality of voids in the intermediate layer. The plurality of voids includes voids adjacent to the boundary layer and separated from the cover layer.

Abstract: The metal mask has a body having a first surface in contact with a surface of a workpiece, a second surface opposite the first surface and a third surface between the first surface and the second surface, and an eave portion continuous with the body portion and projecting outwards from the first surface, the eave portion being arranged away from the surface of the workpiece. The third surface (side surface) of the body portion of the metal mask may have a stepped portion formed of the eave portion. The third surface (side surface) of the body part has an inclined surface that extends from the first surface to the second surface and may have a structure in which the eave portion is arranged above the inclined surface.

Abstract: A stage includes a base material including a step portion and an insulating film. The step portion includes a first surface recessed from a top surface of the base material and a second surface recessed from a side surface of the base material. The insulating film includes a plurality of first layers on the first surface and a plurality of second layers on the second surface. In the step portion, each first end portion of the plurality of first layers and each second end portion of the plurality of second layers are alternately stacked. The first surface and the second surface are connected via a corner, and each first end portion and each second end portion are alternately stacked at the corner.