Patents by Inventor Michiyuki Nakazawa

Michiyuki Nakazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230317352
    Abstract: In an electronic component, a first inductor and a second inductor are disposed side by side in a first direction, and in a region where the first inductor and the second inductor are adjacent to each other in the first direction, at least one of positions in a second direction of an upper surface of a first inductor pattern, and an upper surface of a second inductor pattern and positions in the second direction of a lower surface of the first inductor pattern and a lower surface of a second inductor pattern, are different.
    Type: Application
    Filed: March 28, 2023
    Publication date: October 5, 2023
    Applicant: TDK CORPORATION
    Inventors: Takeshi OOHASHI, Michiyuki NAKAZAWA, Takashi OHTSUKA
  • Patent number: 7847657
    Abstract: Disclosed is a surface acoustic wave filter comprising two or more IDTs arranged in a propagation direction of the surface acoustic wave, wherein said two or more IDTs include at least one pair of IDTs arranged adjacent to each other in order to be acoustically coupled to each other, and have different numbers of paired electrode fingers, and a pitch between each neighboring two of almost all of the electrode fingers included in one of the pair of IDTs which has the smaller number of paired electrode fingers is made different from one to another in order that the IDTs should include no primary pitch area.
    Type: Grant
    Filed: March 12, 2008
    Date of Patent: December 7, 2010
    Assignee: TDK Corporation
    Inventors: Masaki Takahashi, Seisuke Mochizuka, Michiyuki Nakazawa
  • Patent number: 7671705
    Abstract: A SAW filter comprises an IDT disposed on a piezo-electric substrate, wherein the IDT includes comb-shaped electrodes having a plurality of interdigital electrodes arranged in a propagation direction of surface acoustic waves and bus bars for connecting these interdigital electrodes, arranged in opposition, and the interdigital electrodes are crossed with one another. The IDT comprises one or more branch electrodes branched from the interdigital electrode and positioned in a non-overlap zone between an overlap zone at which the interdigital electrodes overlap and the bus bar, and the branch electrode includes a branch electrode body extending in a direction substantially orthogonal to the propagation direction of surface acoustic wave. The SAW filter can be applied to any of a longitudinally coupled multi-mode filter, a ladder type filter, a resonator, a filter having a resonator connected in series to a longitudinally coupled multi-mode filter, and the like.
    Type: Grant
    Filed: September 26, 2007
    Date of Patent: March 2, 2010
    Assignee: TDK Corporation
    Inventors: Michiyuki Nakazawa, Seisuke Mochizuka, Masaki Takahashi
  • Publication number: 20080238576
    Abstract: Disclosed is a surface acoustic wave filter comprising two or more IDTs arranged in a propagation direction of the surface acoustic wave, wherein said two or more IDTs include at least one pair of IDTs arranged adjacent to each other in order to be acoustically coupled to each other, and have different numbers of paired electrode fingers, and a pitch between each neighboring two of almost all of the electrode fingers included in one of the pair of IDTs which has the smaller number of paired electrode fingers is made different from one to another in order that the IDTs should include no primary pitch area.
    Type: Application
    Filed: March 12, 2008
    Publication date: October 2, 2008
    Applicant: TDK CORPORATION
    Inventors: Masaki Takahashi, Seisuke Mochizuka, Michiyuki Nakazawa
  • Patent number: 7414494
    Abstract: A surface acoustic wave apparatus includes an input terminal, an output terminal, a plurality of acoustically coupled interdigital transducers (IDT), and a phase rotating element (line or inductor) connected in parallel with one or more IDT's. The acoustically coupled IDT's are connected in series between the input and output terminals. Alternatively, the acoustically coupled IDT's may include a series IDT to which the phase rotating element is connected and which is connected in series between the input and output terminals, and a branch IDT acoustically coupled to the series IDT, and disposed on a transmission path which branches from a transmission path between the input and output terminals to a reference potential. Among the plurality of IDT's, ?a??b is established, where ?a represents an electrode finger pitch of the IDT to which the phase rotating element is connected, and ?b represents an electrode finger pitch of the IDT to which no phase rotating element is connected.
    Type: Grant
    Filed: October 26, 2005
    Date of Patent: August 19, 2008
    Assignee: TDK Corporation
    Inventors: Michiyuki Nakazawa, Seisuke Mochizuka
  • Publication number: 20080079512
    Abstract: A SAW filter comprises an IDT disposed on a piezo-electric substrate, wherein the IDT includes comb-shaped electrodes having a plurality of interdigital electrodes arranged in a propagation direction of surface acoustic waves and bus bars for connecting these interdigital electrodes, arranged in opposition, and the interdigital electrodes are crossed with one another. The IDT comprises one or more branch electrodes branched from the interdigital electrode and positioned in a non-overlap zone between an overlap zone at which the interdigital electrodes overlap and the bus bar, and the branch electrode includes a branch electrode body extending in a direction substantially orthogonal to the propagation direction of surface acoustic wave. The SAW filter can be applied to any of a longitudinally coupled multi-mode filter, a ladder type filter, a resonator, a filter having a resonator connected in series to a longitudinally coupled multi-mode filter, and the like.
    Type: Application
    Filed: September 26, 2007
    Publication date: April 3, 2008
    Applicant: TDK CORPORATION
    Inventors: Michiyuki NAKAZAWA, Seisuke MOCHIZUKA, Masaki TAKAHASHI
  • Publication number: 20060091976
    Abstract: A surface acoustic wave apparatus includes an input terminal, an output terminal, a plurality of acoustically coupled interdigital transducers (IDT), and a phase rotating element (line or inductor) connected in parallel with one or more IDT's. The acoustically coupled IDT's are connected in series between the input and output terminals. Alternatively, the acoustically coupled IDT's may include a series IDT to which the phase rotating element is connected and which is connected in series between the input and output terminals, and a branch IDT acoustically coupled to the series IDT, and disposed on a transmission path which branches from a transmission path between the input and output terminals to a reference potential. Among the plurality of IDT's, ?a??b is established, where ?a represents an electrode finger pitch of the IDT to which the phase rotating element is connected, and ?b represents an electrode finger pitch of the IDT to which no phase rotating element is connected.
    Type: Application
    Filed: October 26, 2005
    Publication date: May 4, 2006
    Applicant: TDK CORPORATION
    Inventors: Michiyuki Nakazawa, Seisuke Mochizuka
  • Patent number: 6580198
    Abstract: A surface acoustic wave device includes a piezoelectric substrate having Al or Al alloy electrodes formed on a surface of the substrate, a metal oxide film provided on the substrate and the electrodes. The metal oxide film is formed by a process including depositing a metal thin film having a thickness sufficiently thin so that the deposited metal thin film is discontinuous including voids, and oxidizing the discontinuous metal thin film, and the metal oxide film includes a continuous portion without voids covering the electrodes.
    Type: Grant
    Filed: June 4, 2001
    Date of Patent: June 17, 2003
    Assignee: TDK Corporation
    Inventors: Masahiro Nakano, Michiyuki Nakazawa, Katsuo Sato
  • Publication number: 20020047495
    Abstract: In a surface acoustic wave device of the invention, a metal oxide layer is formed on the surface of a piezoelectric substrate having electrodes comprising Al or an Al alloy in such a way as to cover at least the electrodes. The metal oxide layer is formed by oxidization of a metal layer thin enough to provide no continuous film. At least a region of the metal layer on the electrodes, wherein the metal layer is present in a discontinuous film form, is so changed by oxidization to a continuous film that more improved effect on prevention of corrosion is achievable. In addition, the provision of the metal oxide layer has no substantial influence on the electrical properties of the surface acoustic wave device.
    Type: Application
    Filed: June 4, 2001
    Publication date: April 25, 2002
    Applicant: TDK CORPORATION
    Inventors: Masahiro Nakano, Michiyuki Nakazawa, Katsuo Sato
  • Patent number: 5929723
    Abstract: In the electrode of a surface acoustic wave apparatus, the element concentration of copper in the aluminum alloy film is higher in the neighbors of grain boundary than the concentration within the crystal grain, and segregates to the neighbors of crystal grain boundary. In the electrode of this surface acoustic wave apparatus, the concentration of copper existing in the form of copper element, rather than in the form of intermetallic compound of copper and aluminum precipitated to the crystal grain boundary, is higher in the crystal grain boundary than the concentration within the crystal grain, and is in the segregation state. A ratio of a copper concentration in the neighbors of grain boundary to a copper concentration within the crystal grain in an aluminum alloy film forming an electrode of a surface acoustic wave apparatus is greater than 1.6. It is preferable that an electrode formed on a surface of the piezoelectric substrate is made of an aluminum alloy film doped with a copper in a range from 0.
    Type: Grant
    Filed: May 7, 1997
    Date of Patent: July 27, 1999
    Assignee: TDK Corporation
    Inventors: Noritoshi Kimura, Masahiro Nakano, Michiyuki Nakazawa, Katsuo Sato