Abstract: Liquid abrasive cleanser compositions sprayable through conventional manual trigger sprayers comprise a polyalkylene glycol, a nonionic surfactant, a pH adjusting agent, an abrasive, and water, wherein sprayability is made possible by the addition of the polyalkylene glycol. The compositions that are sprayable and acceptable as hard surface cleaners comprise polyethylene glycol as the polyalkylene glycol. The addition of polyethylene glycol having molecular weight of from about 4,000 to about 1,000,000 dramatically increases the sprayer output volume of liquid abrasive compositions having greater than or equal to 10 wt. % calcium carbonate. Addition of polyethylene glycol of molecular weight of from about 4,000 to about 100,000 converts otherwise non-sprayable liquid abrasive compositions into reliably sprayable compositions.

Abstract: Liquid abrasive cleanser compositions sprayable through conventional manual trigger sprayers comprise a polyalkylene glycol, a nonionic surfactant, a pH adjusting agent, an abrasive, and water, wherein sprayability is made possible by the addition of the polyalkylene glycol. The compositions that are sprayable and acceptable as hard surface cleaners comprise polyethylene glycol as the polyalkylene glycol. The addition of polyethylene glycol having molecular weight of from about 4,000 to about 1,000,000 dramatically increases the sprayer output volume of liquid abrasive compositions having greater than or equal to 10 wt. % calcium carbonate. Addition of polyethylene glycol of molecular weight of from about 4,000 to about 100,000 converts otherwise non-sprayable liquid abrasive compositions into reliably sprayable compositions.

Abstract: A multi-surface kitchen cleaning system is described that allows for easier cleaning of all residential and commercial kitchen surfaces from all angles, especially underneath a range hood and up inside an oven, and which comprises an alkaline/nonionic composition contained in and dispensable from a package comprising an angled-neck sprayer bottle fitted with an invertible trigger sprayer assembly, wherein the cleaning system may be used in an entirely upside-down orientation to spray upwards at an acute angle.

Abstract: A multi-surface kitchen cleaning system is described that allows for easier cleaning of all residential and commercial kitchen surfaces from all angles, especially underneath a range hood and up inside an oven, and which comprises an alkaline/nonionic composition contained in and dispensable from a package comprising an angled-neck sprayer bottle fitted with an invertible trigger sprayer assembly, wherein the cleaning system may be used in an entirely upside-down orientation to spray upwards at an acute angle.

Abstract: Removal compositions and processes for removing at least one material layer from a rejected microelectronic device structure having same thereon. The removal composition includes hydrofluoric acid. The composition achieves substantial removal of the material(s) to be removed while not damaging the layers to be retained, for reclaiming, reworking, recycling and/or reuse of said structure.

Abstract: A process for etching silicon wafers using a caustic etchant in the form of an aqueous solution comprising water, a hydroxide ion source, and a chelating agent. The process produces silicon wafers substantially free from diffused metal ions.

Abstract: A wafer carrier for retaining at least one semiconductor wafer in a processing apparatus during a processing operation which removes wafer material by at least one of abrading and chemical reaction. The processing apparatus is adapted for removing wafer material from a front side and a back side of each wafer simultaneously. The carrier includes a plate including wafer contaminating material and having an opening and a thickness. An insert has a thickness and is disposed in the opening for receiving at least one wafer and engaging a peripheral edge of the wafer to hold the wafer as the carrier rotates. The thickness of the insert is significantly greater than the thickness of the plate to inhibit removal of material from the plate and thereby inhibit bulk metal contamination of the wafer.

Abstract: A process for etching silicon wafers using a caustic etchant in the form of an aqueous solution comprising water, a hydroxide ion source, and a chelating agent. The process produces silicon wafers substantially free from diffused metal ions.

Abstract: A wafer carrier for retaining at least one semiconductor wafer in a processing apparatus during a processing operation which removes wafer material by at least one of abrading and chemical reaction. The processing apparatus is adapted for removing wafer material from a front side and a back side of each wafer simultaneously. The carrier includes a plate including wafer contaminating material and having an opening and a thickness. An insert has a thickness and is disposed in the opening for receiving at least one wafer and engaging a peripheral edge of the wafer to hold the wafer as the carrier rotates. The thickness of the insert is significantly greater than the thickness of the plate to inhibit removal of material from the plate and thereby inhibit bulk metal contamination of the wafer.

Abstract: A method of manufacturing a semiconductor wafer includes providing an ingot of semiconductor material, slicing the wafer from the ingot, and processing the wafer to increase parallelism of the front surface and the back surface. A final polishing operation on at least the front surface is performed by positioning the wafer between a first pad and a second pad and obtaining motion of the front and back surfaces of the wafer relative to the first and second pads to maintain parallelism of the front and back surfaces and to produce a finish on at least the front surface of the wafer so that the front surface is prepared for integrated circuit fabrication. In another aspect, the wafer is rinsed by a rinsing fluid to increase hydrodynamic lubrication. Other methods are directed to conditioning the polishing pad and to handling wafers after polishing. An apparatus for polishing wafers is also included.

Abstract: A method of manufacturing a semiconductor wafer includes providing an ingot of semiconductor material, slicing the wafer from the ingot, and processing the wafer to increase parallelism of the front surface and the back surface. A final polishing operation on at least the front surface is performed by positioning the wafer between a first pad and a second pad and obtaining motion of the front and back surfaces of the wafer relative to the first and second pads to maintain parallelism of the front and back surfaces and to produce a finish on at least the front surface of the wafer so that the front surface is prepared for integrated circuit fabrication. In another aspect, the wafer is rinsed by a rinsing fluid to increase hydrodynamic lubrication. Other methods are directed to conditioning the polishing pad and to handling wafers after polishing. An apparatus for polishing wafers is also included.