Patents by Inventor Mickaël JOINET

Mickaël JOINET has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12640328
    Abstract: A production method for producing an anode for a cold cathode X-ray source, including the following steps: producing an element referred to as target from a first material adapted to generating X-rays from the absorption of an electron beam, the first material having a first thermal expansion coefficient Ce,1(Tu) at a predetermined temperature Tu of use of the anode in the X-ray source, producing an element referred to as target support from a second material having a second thermal expansion coefficient Ce,2(Tu) at the predetermined temperature Tu, joining the target to the target support by hard soldering using a solder material at a soldering temperature higher than the predetermined temperature Tu and higher than a melting point of the solder material, so as to form a film of solder interposed between the target and the target support.
    Type: Grant
    Filed: January 31, 2023
    Date of Patent: May 26, 2026
    Assignee: THALES
    Inventors: Guillaume Royer, Christophe Bourat, Michel Caplot, Mickaël Joinet, Pierre Ribault
  • Publication number: 20250140507
    Abstract: A production method for producing an anode for a cold cathode X-ray source, including the following steps: producing an element referred to as target from a first material adapted to generating X-rays from the absorption of an electron beam, the first material having a first thermal expansion coefficient Ce,1(Tu) at a predetermined temperature Tu of use of the anode in the X-ray source, producing an element referred to as target support from a second material having a second thermal expansion coefficient Ce,2(Tu) at the predetermined temperature Tu, joining the target to the target support by hard soldering using a solder material at a soldering temperature higher than the predetermined temperature Tu and higher than a melting point of the solder material, so as to form a film of solder interposed between the target and the target support.
    Type: Application
    Filed: January 31, 2023
    Publication date: May 1, 2025
    Inventors: Guillaume ROYER, Christophe BOURAT, Michel CAPLOT, Mickaël JOINET, Pierre RIBAULT