Patents by Inventor Mickael FOUREL

Mickael FOUREL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Image acquisition device
    Patent number: 11948950
    Abstract: An image acquisition device includes an array of color filters and an array of microlenses over the array of color filters. At least one layer made from an inorganic dielectric material is formed between the array of color filters and the array of microlenses.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: April 2, 2024
    Assignee: STMicroelectronics (Crolles 2) SAS
    Inventors: Mickael Fourel, Laurent-Luc Chapelon
  • IMAGE ACQUISITION DEVICE
    Publication number: 20210327936
    Abstract: An image acquisition device includes an array of color filters and an array of microlenses over the array of color filters. At least one layer made from an inorganic dielectric material is formed between the array of color filters and the array of microlenses.
    Type: Application
    Filed: April 7, 2021
    Publication date: October 21, 2021
    Applicant: STMicroelectronics (Crolles 2) SAS
    Inventors: Mickael FOUREL, Laurent-Luc CHAPELON
  • Three-dimensional integrated photonic structure with improved optical properties
    Patent number: 10012792
    Abstract: An integrated electronic device includes a substrate having an opening extending therethrough. The substrate includes an interconnection network, and connections coupled to the interconnection network. The connections are to be fixed on a printed circuit board. An integrated photonic module is electrically connected to the substrate, with a portion of the integrated photonic module in front of or overlapping the opening of the substrate. An integrated electronic module is electrically connected to the photonic module, and extends at least partly into the opening of the substrate. The electronic module and the substrate may be electrically connected onto the same face of the photonic module.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: July 3, 2018
    Assignee: STMICROELECTRONICS (CROLLES 2) SAS
    Inventors: Jean-Francois Carpentier, Patrick Lemaitre, Mickael Fourel
  • THREE-DIMENSIONAL INTEGRATED PHOTONIC STRUCTURE WITH IMPROVED OPTICAL PROPERTIES
    Publication number: 20170199329
    Abstract: An integrated electronic device includes a substrate having an opening extending therethrough. The substrate includes an interconnection network, and connections coupled to the interconnection network. The connections are to be fixed on a printed circuit board. An integrated photonic module is electrically connected to the substrate, with a portion of the integrated photonic module in front of or overlapping the opening of the substrate. An integrated electronic module is electrically connected to the photonic module, and extends at least partly into the opening of the substrate. The electronic module and the substrate may be electrically connected onto the same face of the photonic module.
    Type: Application
    Filed: July 22, 2016
    Publication date: July 13, 2017
    Inventors: Jean-Francois CARPENTIER, Patrick LEMAITRE, Mickael FOUREL