Abstract: An antenna bracket for electronic devices includes a solid bracket having an aperture formed therethrough. The solid antenna bracket has side walls that are rounded to a predetermined radius, and at least one antenna pocket positioned on said side walls. The antenna pocket receives and secures at least one antenna. The antenna bracket has a polygon shape that follows the contours of the electronic device housing.

Abstract: A method for manufacturing an electronic device including configuring one or more circuit boards with a plurality of antennas connected to at least one circuit board having wire securing slots. The electronic device having vertical orientation and an outer casing including a case bottom piece, a case top front piece, and a case top back piece. Features include providing staging slots in the case top back piece holding the board at an angle with respect to the interior surface of the case top back piece to permit connections to the circuit board which includes connecting antenna wires to connectors on the circuit board having antenna wires secured in wire securing slots prior to connecting to antenna connectors. The circuit board attached to only one side wall of one of the case front top piece or the case top back piece.

Abstract: An antenna bracket for electronic devices includes a solid bracket having an aperture formed therethrough. The solid antenna bracket has side walls that are rounded to a predetermined radius, and at least one antenna pocket positioned on said side walls. The antenna pocket receives and secures at least one antenna. The antenna bracket has a polygon shape that follows the contours of the electronic device housing.

Abstract: Apparatus providing a thermal interface includes a printed circuit board configured to be thermally coupled to a component to dissipate heat from the printed circuit board and including a surface to be thermally coupled to a surface of the component with a thermally conductive substance such as a thermal putty included in a region between the surface of the printed circuit board and the surface of the component and the surface of the printed circuit board includes a pattern of features configured to decrease migration of the thermal putty out of the region.

Abstract: A memory card reader interface with an improved thumb scoop or recess (208) for preventing improper insertion of a memory card is provided. The memory card reader interface of the present disclosure may be formed on a housing of an electronic or host device and includes a memory card slot having an opening in an outer surface of the housing configured to receive a memory card for insertion into the memory card slot. A recess, also known as a thumb scoop, is configured at the opening of the memory card slot to allow gripping and extraction access to a memory card inside the memory card slot. The recess of the memory card interface of the present disclosure is configured in such a manner as to prevent improper insertion of a memory card into the memory card slot.

Abstract: An improved F-connector can be mounted perpendicularly on a printed circuit board to reduce radiated emissions by using an integrated shield flange on the F-connector body. The improved F-connector is attached to a shield frame that is part of an RF shield containment box mounted on the printed circuit board. In one embodiment, the shield flange is integral to the improved F-connector body and is manufactured to fill the gap between an RF shield frame and a corresponding RF shield cover. The improved F-connector with integral shielding flange mounted on the shield frame utilizes the shield flange of the improved F-connector to fill the physical gaps between the shield cover the improved F-connector. With reduced or eliminated physical gaps, the radiated emission of the assembly are either reduced or eliminated.

Abstract: A method for manufacturing an electronic device including configuring one or more circuit boards with a plurality of antennas connected to at least one circuit board having wire securing slots. The electronic device having vertical orientation and an outer casing including a case bottom piece, a case top front piece, and a case top back piece. Features include providing staging slots in the case top back piece holding the board at an angle with respect to the interior surface of the case top back piece to permit connections to the circuit board which includes connecting antenna wires to connectors on the circuit board having antenna wires secured in wire securing slots prior to connecting to antenna connectors. The circuit board attached to only one side wall of one of the case front top piece or the case top back piece.

Abstract: An improved F-connector can be mounted perpendicularly on a printed circuit board to reduce radiated emissions by using an integrated shield flange on the F-connector body. The improved F-connector is attached to a shield frame that is part of an RF shield containment box mounted on the printed circuit board. In one embodiment, the shield flange is integral to the improved F-connector body and is manufactured to fill the gap between an RF shield frame and a corresponding RF shield cover. The improved F-connector with integral shielding flange mounted on the shield frame utilizes the shield flange of the improved F-connector to fill the physical gaps between the shield cover the improved F-connector. With reduced or eliminated physical gaps, the radiated emission of the assembly are either reduced or eliminated.