Abstract: An adapter apparatus and methods for using in providing such adapter apparatus include providing a substrate having a plurality of openings defined therethrough. A plurality of conductive elements are mounted within corresponding openings thereof using a curable material.

Abstract: A packaged device adapter assembly for use with high density integrated circuit packages, e.g., micro lead frame packages, micro lead chip carriers, quad flat no lead packages, and micro ball grid array packages, etc., includes an alignment structure for aligning a packaged device therein.

Abstract: A packaged device adapter assembly for use with high density integrated circuit packages, e.g., micro lead frame packages, micro lead chip carriers, quad flat no lead packages, and micro ball grid array packages, etc., includes an alignment structure for aligning a packaged device therein.

Abstract: An adapter apparatus is provided for receiving a packaged device having a plurality of contact elements disposed on a surface thereof. The adapter apparatus includes a perimeter wall member having a length along an adapter axis between a first end of the wall member and a second end of the wall member. A conductive element layer including arranged contact elements is positioned at the first end of the perimeter wall member orthogonal to the adapter axis. The perimeter wall member and the conductive element layer define a socket cavity to receive the packaged device with the contact elements thereof adjacent the arranged conductive elements of the conductive element layer. A cover member is positioned at the second end of the perimeter wall member to close the socket cavity. The cover member is movable to allow the packaged device to be removed from the socket cavity.

Abstract: A pluggable mounting apparatus provides for mounting a mountable structure having a plurality of contact elements on a surface thereof to a target having a plurality of contact elements on a surface thereof. The pluggable mounting apparatus includes a pin array portion and a mounting base having a defined cavity sized to receive at least a portion of a body member of the pin array portion. The mounting apparatus further includes a conductive element layer, e.g., a conductive elastomer layer, positioned in the cavity for electrical contact with a plurality of pin contact elements extending from an end of the body member of the pin array portion when the portion of the body member of the pin array portion is received in the cavity. Au adapter apparatus usable with the mounting apparatus is also provided. The adaptor apparatus also uses a conductive element layer, e.g., a conductive elastomer layer.