Abstract: A hysteretic power converter constituted of: a switched mode power supply; a hysteretic comparator, a first input of the comparator arranged to receive a feedback signal providing a representation of the output voltage of the switched mode power supply and a second input of the comparator arranged to receive a reference voltage; a ramp capacitor coupled to one of the first and second input of the comparator; a current source, a terminal of the current source coupled to the ramp capacitor and arranged to drive current to the ramp capacitor; and a switchable current source, a terminal of the switchable current source coupled to the ramp capacitor, the switchable current source arranged to drive current to the ramp capacitor in a direction opposite the current driven by the current source, wherein the switchable current source is alternately enabled and disabled responsive to the output of the hysteretic comparator.

Abstract: A high power surface mount package including a thick bond line of solder interposed between the die and a heatsink, and between the die and a lead frame, wherein the lead frame has the same coefficient of thermal expansion as the heatsink. The heatsink and the lead frame preferably comprise the same material. The package can be assembled using standard automated equipment, and does not require a weight or clip to force the parts close together, which force typically reduces the solder bond line thickness. Advantageously, the thermal stresses on each side of the die are effectively balanced, allowing for a large surface area die to be packaged with conventional and less expensive materials. One type of die that benefits from the present invention can include a transient voltage suppressor, but could include other dies generating a significant amount of heat, such as those in excess of 0.200 inches square.