Abstract: A Vertical Power MOSFET (VDMOS) device with special features that enable the Power MOSFET or IGBT device to withstand harsh radiation environments and the process of making such a device is described. All implanted and diffused layers are “self aligned” to a “Sacrificial Poly” layer, which later on is removed, preparing the wafers for a “late gate” oxide to be grown. A starting material with graded doping profile in the epitaxial layer on the substrate is shown to increase the SEB capability of the Power MOSFET.

Abstract: Methods, systems, and devices are described for providing a communication system for handling pulse information. Embodiments of the invention provide a pulse shaping unit operable to avoid saturation of the pulse transformer, while being easily incorporated into IC processes. Some embodiments of the pulse shaping unit provide a two-to-three level driver unit for converting a two-level input voltage signal to a three-level driver signal for driving a pulse transformer. Other embodiments of the pulse shaping unit provide components configured to differentially drive a pulse transformer, effectively converting a two-level input voltage signal to a three-level driver signal.

Abstract: An apparatus for assessing at least one property of a target soil responsive to a first a first microwave signal, constituted of: a detector; a probe arranged to be embedded in the target soil; and a coupler arranged to couple a first portion of the first microwave signal to the first end of the probe, and to couple a second portion of the generated first microwave signal as a microwave reference signal to a reference input of the detector; the detector arranged to square each of the microwave signal exiting the probe and the microwave reference signal and to output a phase difference signal indicative of the phase difference between the squared probe output microwave signal and the squared microwave reference signal; and a control circuitry coupled to the output of the detector and arranged to output an irrigation control signal responsive to the phase difference signal.

Abstract: An arrangement wherein a plurality of LED strings are driven with a balanced drive signal, i.e. a drive signal wherein the positive side and negative side are of equal energy over time, is provided. In a preferred embodiment, the drive signal is balanced responsive to a capacitor provided between a switching network and a driving transformer. Balance of current between various LED strings is provided by a balancing transformer.

Abstract: A hysteretic power converter constituted of: a switched mode power supply; a hysteretic comparator, a first input of the comparator arranged to receive a feedback signal providing a representation of the output voltage of the switched mode power supply and a second input of the comparator arranged to receive a reference voltage; a ramp capacitor coupled to one of the first and second input of the comparator; a current source, a terminal of the current source coupled to the ramp capacitor and arranged to drive current to the ramp capacitor; and a switchable current source, a terminal of the switchable current source coupled to the ramp capacitor, the switchable current source arranged to drive current to the ramp capacitor in a direction opposite the current driven by the current source, wherein the switchable current source is alternately enabled and disabled responsive to the output of the hysteretic comparator.

Abstract: An apparatus for LED string short circuit detection constituted of: a constant current drive circuit; a plurality of LED strings, a first end of each of the plurality of LED strings coupled to a common output of the constant current drive circuit; a first sense resistor coupled between a second end of each of the plurality of LED strings and a chassis; a second sense resistor coupled between the chassis and a return of the constant current drive circuit; and a comparing circuit arranged to compare the amount of current flow through the first sense resistor with amount of current flow through the second sense resistor, the comparing circuit arranged to assert a fault signal in the event that the amount of current flow through the second sense resistor exceeds the current flow through the first sense resistor by a predetermined minimum value.

Abstract: A high power surface mount package including a thick bond line of solder interposed between the die and a heatsink, and between the die and a lead frame, wherein the lead frame has the same coefficient of thermal expansion as the heatsink. The heatsink and the lead frame preferably comprise the same material. The package can be assembled using standard automated equipment, and does not require a weight or clip to force the parts close together, which force typically reduces the solder bond line thickness. Advantageously, the thermal stresses on each side of the die are effectively balanced, allowing for a large surface area die to be packaged with conventional and less expensive materials. One type of die that benefits from the present invention can include a transient voltage suppressor, but could include other dies generating a significant amount of heat, such as those in excess of 0.200 inches square.