Abstract: To provide a catalyst capable of hydrotreating a hydrocarbon oil with high desulfurization activity. A hydrotreating catalyst for a hydrocarbon oil includes: an inorganic composite oxide carrier including alumina as a main component; and an active metal component supported on the carrier, the active metal component including, as active metal species, a first metal which is at least one of molybdenum and tungsten, and a second metal which is at least one of cobalt and nickel, the hydrotreating catalyst for having a Lewis acid amount and a Brönsted acid amount per unit surface area of 0.80 ?mol/m2 or more and 0.03 ?mol/m2 or less, respectively, as measured by pyridine desorption at 250° C. and a BET single-point method.

Abstract: To provide a catalyst capable of hydrotreating a hydrocarbon oil with high desulfurization activity. A hydrotreating catalyst for a hydrocarbon oil includes: an inorganic composite oxide carrier including alumina as a main component; and an active metal component supported on the carrier, the active metal component including, as active metal species, a first metal which is at least one of molybdenum and tungsten, and a second metal which is at least one of cobalt and nickel, the hydrotreating catalyst for having a Lewis acid amount and a Brönsted acid amount per unit surface area of 0.80 ?mol/m2 or more and 0.03 ?mol/m2 or less, respectively, as measured by pyridine desorption at 250° C. and a BET single-point method.

Abstract: A flip-chip bonding apparatus (100) is provided with: a bonding tool (10) that includes a base (11), and an island (13) that vacuum-sucks, to a surface (14) thereof, a semiconductor die (70) having protruding electrodes (72, 73) that are disposed on both the surfaces; and a heater (20) that heats the semiconductor die (70) vacuum-sucked to the island (13). The flip-chip bonding apparatus heats the semiconductor die (70), bonds the protruding electrodes (73) of the semiconductor die (70) to protruding electrodes (82) of a semiconductor die (80), and seals, using a non-conductive film (NCF) (75), a gap between the semiconductor die (70) and the semiconductor die (80). Continuous vacuum suction holes (15) are provided in the base (11), said continuously vacuum suction holes being at positions adjacent to the outer peripheral surface of the island (13).

Abstract: A flip-chip bonding apparatus (100) is provided with: a bonding tool (10) that includes a base (11), and an island (13) that vacuum-sucks, to a surface (14) thereof, a semiconductor die (70) having protruding electrodes (72, 73) that are disposed on both the surfaces; and a heater (20) that heats the semiconductor die (70) vacuum-sucked to the island (13). The flip-chip bonding apparatus heats the semiconductor die (70), bonds the protruding electrodes (73) of the semiconductor die (70) to protruding electrodes (82) of a semiconductor die (80), and seals, using a non-conductive film (NCF) (75), a gap between the semiconductor die (70) and the semiconductor die (80). Continuous vacuum suction holes (15) are provided in the base (11), said continuously vacuum suction holes being at positions adjacent to the outer peripheral surface of the island (13).

Abstract: A wiring board unit includes a connector having a plurality of terminals; and a wiring board on which the connector is mounted. The wiring board includes a first wiring pattern provided on a first wiring layer, a second wiring pattern provided on a second wiring layer at a position shallower than the first wiring layer, a first via formed in a first recess having a first depth, the first via being in contact with the first wiring pattern, and a second via formed in a second recess having a second depth that is smaller than the first depth, the second via being in contact with the second wiring pattern.

Abstract: A via is formed in a printed circuit board to penetrate through an insulating layer. A guard pattern, made of an electrically-conductive material, extends on the front surface of the insulating layer along a circle concentric with the via. An electrically-conductive body extends from the guard pattern in the insulating layer along an imaginary cylinder concentric with the via. The guard pattern of the printed circuit board serves to control the characteristic impedance of the via at the front surface of the insulating layer. The electrically-conductive body contributes to a better control of the characteristic impedance of the via. The via is allowed to reliably enjoy a better impedance matching than ever. Noise can sufficiently be suppressed in electric signals running through the via.

Abstract: A laundry system includes a home terminal device and laundry apparatus. The terminal device includes a first short-range communication device, a long-range communication device, and a terminal device controller transmitting information about laundry and a laundry constraint to a server connected to an Internet, thereby obtaining an operation control program for the laundry apparatus. The terminal device controller transfers the program via the first short-range communication device to the laundry apparatus and receives via the first short-range communication device information about an operating state of the laundry apparatus. The laundry apparatus includes a second short-range communication device, a laundry apparatus controller, and a laundry unit.

Abstract: A via is formed in a printed circuit board to penetrate through an insulating layer. A guard pattern, made of an electrically-conductive material, extends on the front surface of the insulating layer along a circle concentric with the via. An electrically-conductive body extends from the guard pattern in the insulating layer along an imaginary cylinder concentric with the via. The guard pattern of the printed circuit board serves to control the characteristic impedance of the via at the front surface of the insulating layer. The electrically-conductive body contributes to a better control of the characteristic impedance of the via. The via is allowed to reliably enjoy a better impedance matching than ever. Noise can sufficiently be suppressed in electric signals running through the via.

Abstract: A laundry system (1) includes a home terminal device (3) and laundry apparatus (4). The terminal device includes a first short-range communication device (8), a long-range communication device (7), and a terminal device controller (9) transmitting information about laundry and information about a laundry constraint to a server (2) connected to an Internet (5), thereby obtaining an operation control program for the laundry apparatus. The terminal device controller transfers the obtained operation control program via the first short-range communication device to the laundry apparatus and receives via the first short-range communication device information about an operating state of the laundry apparatus. The laundry apparatus includes a second short-range communication device (15), a laundry apparatus controller (17), and a laundry unit (16).

Abstract: The present invention of the application provides a method for producing an antibody which comprises inoculating an expression vector expressing a fusion protein to an animal, and isolating and purifying an antibody against an antigenic protein from the animal, wherein the fusion protein is an antigenic protein fused to the C-terminal side of a transmembrane domain in which the N-terminal side is located in the cell and the C-terminal is out of the cell. According to the present invention, an antibody against an antigenic protein, which it was difficult to produce in the so far known gene immunization, can be produced. The resulting an antibody is useful as drugs, diagnostic agents, and reagents for the research.

Abstract: Proteins containing any of the amino acid sequences represented by Sequence No. 1 to Sequence No. 2 or by Sequence No. 4 to Sequence No. 25 and DNAs encoding said proteins exemplified by cDNAs containing any of the base sequences represented by Sequence No. 26 to Sequence No. 50. Said proteins can be provided by expressing cDNAs encoding human proteins having transmembrane domains and recombinants of these human cDNAs.

Abstract: Isolated cDNAs derived from mRNAs expressed in human cells are provided, as are DNAs and RNAs comprising their nucleotide sequences, and vectors for expressing the cDNAs. The cDNAs encode proteins which have functions similar to known proteins.