Patents by Inventor Miei TAKAHAMA

Miei TAKAHAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200024710
    Abstract: An object of the present invention is to provide an electroformed part favorable for an assembly part of a timepiece or the like and a timepiece using the same. The present invention relates to an electroformed part, which is an electroformed part composed of a nickel-iron alloy constituted by nickel, iron, and unavoidable impurities, containing iron at 5 to 25% by mass, and having a roughly layered form portion in which a stacked form portion having an inclined iron content in a thickness direction is repeatedly stacked a plurality of times. It is preferred that the stacked portion is constituted by crystal grains having an average grain diameter of 50 nm or less.
    Type: Application
    Filed: July 15, 2019
    Publication date: January 23, 2020
    Inventors: MATSUO KISHI, Miei Takahama
  • Patent number: 10504957
    Abstract: A semiconductor device includes a semiconductor substrate having a plurality of Hall elements formed therein, and a magnetic body formed on the semiconductor substrate and having a magnetic flux converging function. The contour in a vertical cross section of the magnetic body on the semiconductor substrate has an outer circumferential portion. At least a part of the outer circumferential portion has a curve-shaped portion and a portion substantially parallel to the semiconductor substrate. A gap is formed between the semiconductor substrate and the portion of the magnetic body that is substantially parallel to the semiconductor substrate, and the gap lies above the entire top surfaces of the Hall elements. The magnetic body has at least a part of a structure made of non-magnetic substance embedded therein.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: December 10, 2019
    Assignee: ABLIC Inc.
    Inventors: Matsuo Kishi, Miei Takahama (nee Sato), Hiroshi Takahashi, Mika Ebihara, Takaaki Hioka
  • Patent number: 10429453
    Abstract: The magnetic sensor includes a semiconductor substrate having Hall elements on a front surface of the semiconductor substrate, an adhesive layer formed on a back surface of the semiconductor substrate, and a magnetic flux converging plate formed on the adhesive layer. The magnetic flux converging plate is formed on the back surface of the semiconductor substrate through formation of the magnetic flux converging plate by electroplating on a base conductive layer formed on a plating substrate prepared separately from the semiconductor substrate, application of an adhesive for forming the adhesive layer onto a surface of the magnetic flux converging plate so that the magnetic flux converging plate adheres to the back surface of the semiconductor substrate, and peeling off of the plating substrate afterward from the base conductive layer formed on the magnetic flux converging plate.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: October 1, 2019
    Assignee: ABLIC INC.
    Inventors: Takaaki Hioka, Mika Ebihara, Hiroshi Takahashi, Matsuo Kishi, Miei Takahama
  • Patent number: 10290677
    Abstract: A semiconductor device includes a semiconductor substrate having a plurality of Hall elements formed therein, and a magnetic body formed on the semiconductor substrate and having a magnetic flux converging function. The contour in vertical cross-section of the magnetic body on the semiconductor substrate has an outer circumferential portion. At least a part of the outer circumferential portion has a portion having an approximate quadrant shape, and a portion contiguous to the approximate quadrant portion and substantially parallel to the semiconductor substrate.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: May 14, 2019
    Assignee: ABLIC Inc.
    Inventors: Matsuo Kishi, Miei Takahama (nee Sato), Hiroshi Takahashi, Mika Ebihara, Takaaki Hioka
  • Patent number: 10062836
    Abstract: The magnetic sensor includes a semiconductor substrate having Hall elements on a front surface of the semiconductor substrate, a conductive layer formed on a back surface of the semiconductor substrate, and a magnetic flux converging plate formed on the conductive layer. The magnetic flux converging plate is formed on the back surface of the semiconductor substrate through formation of the base conductive layer on the back surface of the semiconductor substrate, formation of a resist on the base conductive layer having an opening for forming the magnetic flux converging plate, formation of the magnetic flux converging plate in the opening of the resist by electroplating, removal of the resist, and removal of a part of the base conductive layer by etching with the magnetic flux converging plate as a mask.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: August 28, 2018
    Assignee: ABLIC INC.
    Inventors: Takaaki Hioka, Mika Ebihara, Hiroshi Takahashi, Matsuo Kishi, Miei Takahama
  • Publication number: 20170269169
    Abstract: The magnetic sensor includes a semiconductor substrate having Hall elements on a front surface of the semiconductor substrate, an adhesive layer formed on a back surface of the semiconductor substrate, and a magnetic flux converging plate formed on the adhesive layer. The magnetic flux converging plate is formed on the back surface of the semiconductor substrate through formation of the magnetic flux converging plate by electroplating on a base conductive layer formed on a plating substrate prepared separately from the semiconductor substrate, application of an adhesive for forming the adhesive layer onto a surface of the magnetic flux converging plate so that the magnetic flux converging plate adheres to the back surface of the semiconductor substrate, and peeling off of the plating substrate afterward from the base conductive layer formed on the magnetic flux converging plate.
    Type: Application
    Filed: March 14, 2017
    Publication date: September 21, 2017
    Inventors: Takaaki HIOKA, Mika EBIHARA, Hiroshi TAKAHASHI, Matsuo KISHI, Miei TAKAHAMA
  • Publication number: 20170271400
    Abstract: A semiconductor device includes a semiconductor substrate having a plurality of Hall elements formed therein, and a magnetic body formed on the semiconductor substrate and having a magnetic flux converging function. The contour in vertical cross-section of the magnetic body on the semiconductor substrate has an outer circumferential portion. At least a part of the outer circumferential portion has a portion having an approximate quadrant shape, and a portion contiguous to the approximate quadrant portion and substantially parallel to the semiconductor substrate.
    Type: Application
    Filed: March 13, 2017
    Publication date: September 21, 2017
    Inventors: Matsuo KISHI, Miei TAKAHAMA (nee SATO), Hiroshi TAKAHASHI, Mika EBIHARA, Takaaki HIOKA
  • Publication number: 20170271401
    Abstract: A semiconductor device and a method of manufacturing the semiconductor device are provided. The semiconductor device includes a semiconductor substrate having a plurality of Hall elements formed therein, and a magnetic body formed on the semiconductor substrate and having a magnetic flux converging function. The contour in vertical-cross section of the magnetic body on the semiconductor substrate has an outer circumferential portion. At least a part of the outer circumferential portion has a curve-shaped portion and a portion substantially parallel to the semiconductor substrate. The magnetic body has at least a part of a structure made of non-magnetic substance embedded therein.
    Type: Application
    Filed: March 13, 2017
    Publication date: September 21, 2017
    Inventors: Matsuo KISHI, Miei TAKAHAMA (nee SATO), Hiroshi TAKAHASHI, Mika EBIHARA, Takaaki HIOKA
  • Publication number: 20170271575
    Abstract: The magnetic sensor includes a semiconductor substrate having Hall elements on a front surface of the semiconductor substrate, a conductive layer formed on a back surface of the semiconductor substrate, and a magnetic flux converging plate formed on the conductive layer. The magnetic flux converging plate is formed on the back surface of the semiconductor substrate through formation of the base conductive layer on the back surface of the semiconductor substrate, formation of a resist on the base conductive layer having an opening for forming the magnetic flux converging plate, formation of the magnetic flux converging plate in the opening of the resist by electroplating, removal of the resist, and removal of a part of the base conductive layer by etching with the magnetic flux converging plate as a mask.
    Type: Application
    Filed: March 14, 2017
    Publication date: September 21, 2017
    Inventors: Takaaki HIOKA, Mika EBIHARA, Hiroshi TAKAHASHI, Matsuo KISHI, Miei TAKAHAMA