Patents by Inventor Miei TAKAHAMA (nee SATO)

Miei TAKAHAMA (nee SATO) has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with hall elements and magnetic flux concentrator
    Patent number: 10504957
    Abstract: A semiconductor device includes a semiconductor substrate having a plurality of Hall elements formed therein, and a magnetic body formed on the semiconductor substrate and having a magnetic flux converging function. The contour in a vertical cross section of the magnetic body on the semiconductor substrate has an outer circumferential portion. At least a part of the outer circumferential portion has a curve-shaped portion and a portion substantially parallel to the semiconductor substrate. A gap is formed between the semiconductor substrate and the portion of the magnetic body that is substantially parallel to the semiconductor substrate, and the gap lies above the entire top surfaces of the Hall elements. The magnetic body has at least a part of a structure made of non-magnetic substance embedded therein.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: December 10, 2019
    Assignee: ABLIC Inc.
    Inventors: Matsuo Kishi, Miei Takahama (nee Sato), Hiroshi Takahashi, Mika Ebihara, Takaaki Hioka
  • Semiconductor device having hall elements formed in a semiconductor substrate and a magnetic body flux concentrator
    Patent number: 10290677
    Abstract: A semiconductor device includes a semiconductor substrate having a plurality of Hall elements formed therein, and a magnetic body formed on the semiconductor substrate and having a magnetic flux converging function. The contour in vertical cross-section of the magnetic body on the semiconductor substrate has an outer circumferential portion. At least a part of the outer circumferential portion has a portion having an approximate quadrant shape, and a portion contiguous to the approximate quadrant portion and substantially parallel to the semiconductor substrate.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: May 14, 2019
    Assignee: ABLIC Inc.
    Inventors: Matsuo Kishi, Miei Takahama (nee Sato), Hiroshi Takahashi, Mika Ebihara, Takaaki Hioka
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20170271401
    Abstract: A semiconductor device and a method of manufacturing the semiconductor device are provided. The semiconductor device includes a semiconductor substrate having a plurality of Hall elements formed therein, and a magnetic body formed on the semiconductor substrate and having a magnetic flux converging function. The contour in vertical-cross section of the magnetic body on the semiconductor substrate has an outer circumferential portion. At least a part of the outer circumferential portion has a curve-shaped portion and a portion substantially parallel to the semiconductor substrate. The magnetic body has at least a part of a structure made of non-magnetic substance embedded therein.
    Type: Application
    Filed: March 13, 2017
    Publication date: September 21, 2017
    Inventors: Matsuo KISHI, Miei TAKAHAMA (nee SATO), Hiroshi TAKAHASHI, Mika EBIHARA, Takaaki HIOKA
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20170271400
    Abstract: A semiconductor device includes a semiconductor substrate having a plurality of Hall elements formed therein, and a magnetic body formed on the semiconductor substrate and having a magnetic flux converging function. The contour in vertical cross-section of the magnetic body on the semiconductor substrate has an outer circumferential portion. At least a part of the outer circumferential portion has a portion having an approximate quadrant shape, and a portion contiguous to the approximate quadrant portion and substantially parallel to the semiconductor substrate.
    Type: Application
    Filed: March 13, 2017
    Publication date: September 21, 2017
    Inventors: Matsuo KISHI, Miei TAKAHAMA (nee SATO), Hiroshi TAKAHASHI, Mika EBIHARA, Takaaki HIOKA