Patents by Inventor Mieko Omotani

Mieko Omotani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7897245
    Abstract: A bonded structure formed by bonding a first structure and a second structure at opposed bonding surfaces to form a microstructure or the like. At least one of the first structure and the second structure is formed of a resin composition including a polypropylene resin and a hydrogenated derivative of a block copolymer of the following general formula X-Y (X is a polymer block immiscible with the polypropylene resin, and Y is a conjugated diene elastomer polymer block). The bonding surfaces are bonded by heating an alkoxysilane or alkylsilane compound or a mixture prepared by adding a hydrogenated derivative of a block copolymer of the general formula X-Y to an alkoxysilane or alkylsilane compound applied to the bonding surface.
    Type: Grant
    Filed: June 15, 2009
    Date of Patent: March 1, 2011
    Assignees: Richell Corporation, Toyama Prefecture
    Inventors: Kazuyuki Yamashita, Mieko Omotani, Takashi Onaga, Kiyokazu Himi
  • Publication number: 20090252928
    Abstract: A bonded structure formed by bonding a first structure and a second structure at opposed bonding surfaces to form a microstructure or the like. At least one of the first structure and the second structure is formed of a resin composition including a polypropylene resin and a hydrogenated derivative of a block copolymer of the following general formula X-Y (X is a polymer block immiscible with the polypropylene resin, and Y is a conjugated diene elastomer polymer block). The bonding surfaces are bonded by heating an alkoxysilane or alkylsilane compound or a mixture prepared by adding a hydrogenated derivative of a block copolymer of the general formula X-Y to an alkoxysilane or alkylsilane compound applied to the bonding surface.
    Type: Application
    Filed: June 15, 2009
    Publication date: October 8, 2009
    Applicants: Richell Corporation, Toyama Prefecture
    Inventors: Kazuyuki YAMASHITA, Mieko OMOTANI, Takashi ONAGA, Kiyokazu HIMI
  • Patent number: 7566503
    Abstract: A bonded structure formed by bonding a first structure and a second structure at opposed bonding surfaces to form a microstructure or the like. At least one of the first structure and the second structure is formed of a resin composition including a polypropylene resin and a hydrogenated derivative of a block copolymer of the following general formula X-Y (X is a polymer block immiscible with the polypropylene resin, and Y is a conjugated diene elastomer polymer block). The bonding surfaces are bonded by heating an alkoxysilane or alkylsilane compound or a mixture prepared by adding a hydrogenated derivative of a block copolymer of the general formula X-Y to an alkoxysilane or alkylsilane compound applied to the bonding surface.
    Type: Grant
    Filed: March 16, 2007
    Date of Patent: July 28, 2009
    Assignees: Richell Corporation, Toyama Prefecture
    Inventors: Kazuyuki Yamashita, Mieko Omotani, Takashi Onaga, Kiyokazu Himi
  • Publication number: 20070196674
    Abstract: A bonded structure formed by bonding a first structure and a second structure at opposed bonding surfaces to form a microstructure or the like. At least one of the first structure and the second structure is formed of a resin composition including a polypropylene resin and a hydrogenated derivative of a block copolymer of the following general formula X-Y (X is a polymer block immiscible with the polypropylene resin, and Y is a conjugated diene elastomer polymer block). The bonding surfaces are bonded by heating an alkoxysilane or alkylsilane compound or a mixture prepared by adding a hydrogenated derivative of a block copolymer of the general formula X-Y to an alkoxysilane or alkylsilane compound applied to the bonding surface.
    Type: Application
    Filed: March 16, 2007
    Publication date: August 23, 2007
    Inventors: Kazuyuki Yamashita, Mieko Omotani, Takashi Onaga, Kiyokazu Himi