Patents by Inventor Mieko SANO

Mieko SANO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same
    Patent number: 9994681
    Abstract: The present invention discloses an organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same, particularly used as an encapsulant in light emitting diodes.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: June 12, 2018
    Assignee: Henkel AG & Co. KGaA
    Inventors: Hao Wu, Wenjuan Tan, Wentao Xing, Yong Zhang, Mieko Sano, Aya Hikita, Tadashi Takano, Liwei Zhang, Carol Yang, Zhiming Li, Juan Du
  • Organopolysiloxane Prepolymer and a Curable Organopolysiloxane Composition Comprising the Same
    Publication number: 20170306100
    Abstract: The present invention discloses an organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same, particularly used as an encapsulant in light emitting diodes.
    Type: Application
    Filed: July 12, 2017
    Publication date: October 26, 2017
    Inventors: Hao Wu, Wenjuan Tan, Wentao Xing, Yong Zhang, Mieko Sano, Aya Hikita, Tadashi Takano, Liwei Zhang, Carol Yang, Zhiming Li, Juan Du
  • Adhesive for electronic component
    Patent number: 9780068
    Abstract: An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: October 3, 2017
    Assignees: HENKEL AG & CO. KGAA, HENKEL IP & HOLDING GMBH
    Inventors: Sugiura Yoko, Horiguchi Yusuke, Mieko Sano, Gina Hoang
  • Sealant composition for electronic device
    Patent number: 9771500
    Abstract: The present invention provides a sealant composition for electronic device, in which the curing does not proceed when heated, which does not cause the problem of use in the mounting process of electronic device. The present invention relates to a sealant composition for electronic device comprising (a) a compound having two or more (meth)acryloyl groups and (c) a nitroxide compound and/or a thiocarbonylthio compound.
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: September 26, 2017
    Assignee: HENKEL AG & CO. KGAA
    Inventors: Yusuke Horiguchi, Kenichiro Sato, Mieko Sano
  • Composition for electronic device
    Patent number: 9576871
    Abstract: The present invention provides a composition of which viscosity does not cause the problem of use at high temperature in the mounting process of electronic device. The present invention relates to a composition for electronic device comprising (a) a (meth)acrylic compound and (c) a particle having a functional group having metal scavenging functionality.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: February 21, 2017
    Assignee: HENKEL AG & CO. KGAA
    Inventors: Yusuke Horiguchi, Kenichiro Sato, Mieko Sano
  • ADHESIVE FOR ELECTRONIC COMPONENT
    Publication number: 20160190094
    Abstract: An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.
    Type: Application
    Filed: March 10, 2016
    Publication date: June 30, 2016
    Applicant: HENKEL AG & Co. KGaA
    Inventors: Sugiura Yoko, Horiguchi Yusuke, Mieko Sano, Gina Hoang
  • SEALANT COMPOSITION FOR ELECTRONIC DEVICE
    Publication number: 20160177148
    Abstract: The present invention provides a sealant composition for electronic device, in which the curing does not proceed when heated, which does not cause the problem of use in the mounting process of electronic device. The present invention relates to a sealant composition for electronic device comprising (a) a compound having two or more (meth)acryloyl groups and (c) a nitroxide compound and/or a thiocarbonylthio compound.
    Type: Application
    Filed: February 3, 2016
    Publication date: June 23, 2016
    Inventors: Yusuke HORIGUCHI, Kenichiro Sato, Mieko Sano
  • Underfill sealant composition
    Patent number: 9334429
    Abstract: The present invention provides a composition which does not cause the problem of use at high temperature in the mounting process of electronic device. The present invention relates to an underfill sealant composition comprising (a) a (meth)acrylic compound and (c) an isocyanuric acid having an allyl group.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: May 10, 2016
    Assignee: Henkel AG & Co. KGaA
    Inventors: Yusuke Horiguchi, Mieko Sano, Kenichiro Sato
  • Adhesive for electronic component
    Patent number: 9305892
    Abstract: An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.
    Type: Grant
    Filed: May 1, 2014
    Date of Patent: April 5, 2016
    Assignees: HENKEL AG & CO. KGAA, HENKEL IP & HOLDING GMBH
    Inventors: Sugiura Yoko, Horiguchi Yusuke, Mieko Sano, Gina Hoang
  • ADHESIVE FOR ELECTRONIC COMPONENT
    Publication number: 20140242757
    Abstract: An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.
    Type: Application
    Filed: May 1, 2014
    Publication date: August 28, 2014
    Applicants: HENKEL IP & HOLDING GMBH, HENKEL JAPAN LIMITED
    Inventors: Sugiura Yoko, Horiguchi Yusuke, Mieko Sano, Gina Hoang
  • SEALANT COMPOSITION FOR ELECTRONIC DEVICE
    Publication number: 20140187714
    Abstract: The present invention provides a sealant composition for electronic device, in which the curing does not proceed when heated, which does not cause the problem of use in the mounting process of electronic device. The present invention relates to a sealant composition for electronic device comprising (a) a compound having two or more (meth)acryloyl groups and (c) a nitroxide compound and/or a thiocarbonylthio compound.
    Type: Application
    Filed: March 7, 2014
    Publication date: July 3, 2014
    Applicant: HENKEL AG & CO. KGAA
    Inventors: Yusuke Horiguchi, Kenichiro Sato, Mieko Sano
  • COMPOSITION FOR ELECTRONIC DEVICE
    Publication number: 20140187659
    Abstract: The present invention provides a composition of which viscosity does not cause the problem of use at high temperature in the mounting process of electronic device. The present invention relates to a composition for electronic device comprising (a) a (meth)acrylic compound and (c) a particle having a functional group having metal scavenging functionality.
    Type: Application
    Filed: March 7, 2014
    Publication date: July 3, 2014
    Applicant: HENKEL AG & CO KGAA
    Inventors: Yusuke HORIGUCHI, Kenichiro SATO, Mieko SANO
  • UNDERFILL SEALANT COMPOSITION
    Publication number: 20140187729
    Abstract: The present invention provides a composition which does not cause the problem of use at high temperature in the mounting process of electronic device. The present invention relates to an underfill sealant composition comprising (a) a (meth)acrylic compound and (c) an isocyanuric acid having an allyl group.
    Type: Application
    Filed: March 7, 2014
    Publication date: July 3, 2014
    Applicant: HENKEL AG & CO. KGAA
    Inventors: Yusuke Horiguchi, Mieko Sano, Kenichiro Sato