Patents by Inventor Miguel Angel Lopez

Miguel Angel Lopez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a semiconductor component from a conductive substrate containing a plurality of vias
    Patent number: 6284570
    Abstract: A semiconductor leadframe assembly (20A) and a method for manufacturing a semiconductor component (50) using the semiconductor leadframe assembly (20A). The semiconductor leadframe assembly (20A) includes a leadframe (10A) having flag portions (18A), lead portions (19A), and vias (14A). The vias (14A) serve as dielectric receiving areas. The assembly (20A) further includes semiconductor chips (21A) mounted on the flag portions (18A) and a dielectric material (33A) that covers the semiconductor chips (21A) and fills the vias (14A). The surface mount semiconductor component (50) is singulated from the semiconductor leadframe assembly (20A) to form electrical interconnects (18, 19) of the surface mount semiconductor component (50).
    Type: Grant
    Filed: December 28, 1998
    Date of Patent: September 4, 2001
    Assignee: Semiconductor Components Industries LLC
    Inventors: Mario Federico Cespedes Betran, Manuel Maximiliano Haro Reyes, Miguel Angel Lopez Osorio, Luis Moreno Hagelsieb, Jose de Jesus De Hijar, Juan Rubio Serrano, Juan Esteban Marquez Rodrigo, David Palafox Garcia