Abstract: A cassette magazine for thin semiconductor wafers comprises first and second sidewalls, one or more rods or plates coupling the first and second sidewalls to one another, and a plurality of slot supports configured to support sides of the thin semiconductor wafers extending inward from both the first sidewall and the second sidewall, the plurality of slot supports having widths sufficient to cause a distance by which centers of the thin semiconductor wafers sag to be less than about 0.3 cm when the thin semiconductor wafers have thicknesses of about 100 ?m and diameters of 200 mm.