Abstract: A laser system comprising an active medium (105) and at least one laser diode (103) that is adapted to pump the active medium, characterized in that the laser diode is arranged such that a radiation plane of laser radiation emitted from the laser diode and corresponding to the greatest emission angle a is essentially parallel or oblique to a longitudinal axis (L) of the active medium (105). The pump LD array is arranged with the long axis of each LD being parallel to the longitudinal axis (L) of the active medium (105). A laser system comprising an active medium and a reflector (530) being arranged such that the reflector surrounds the active medium (505) with at distance to the active medium characterized in that the reflector comprises a self-supporting cylinder consisting at least in part of a metal, e.g.

Abstract: A system for modifying a surface of an object, including a transport mechanism for transporting an object, a laser pulse generator for generating a laser pulse having an energy between 200 mJ and 400 mJ by pumping an active medium, a spatial light modulator being adapted to spatially modulate a laser pulse generated by the laser pulse generator and including an emitting surface that is adapted to emit a spatially modulated laser pulse, the spatial light modulator and the laser pulse generator being arranged to emit a spatially modulated laser pulse onto a surface of an object transported by the transport mechanism, wherein the laser pulse generator includes a Q-switch and a control unit that is adapted to control the point in time the Q-switch is switched, depending on a transport property of the object; and a method for modifying the surface of an object.

Abstract: A solder-free laser module which comprises at least one laser chip clamp-mounting between electrodes. The laser module includes: some electrodes facing each other and having opposite poles; insulating separators placed between the facing surfaces of the electrodes to prevent direct contact between them and their short-circuiting; laser chips mounted between the facing surfaces of said electrodes, making contact with the electrodes, and clamping means for bringing the electrodes facing each other more closely together to ensure their contact with the laser chips positioned between them, thereby ensuring electrical power supply to the aforesaid laser chips and dissipation of the heat generated. The invention further relates to a method for assembling the aforesaid laser module.