Abstract: Methods, systems, and apparatus, including an optical receiver including an optical source, including a substrate; a laser provided on the substrate, the laser having first and second sides and outputting first light from the first side and second light from the second side, the first light output from the first side of the laser has a first power and the second light output from the second side has a second power; and a first modulator that receives the first light and a second modulator that receives the second light, such that the power of the first light at an input of the first modulator is substantially equal to the power of the second light at an input of the second modulator.

Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including an active optical element; an electrode configured to receive an electrical signal; a ground electrode; and a bond contact electrically coupled to the electrode; and an ASIC chip including circuitry configured to provide the electrical signal; and a bond contact that is electrically coupled to the circuitry; an bridge chip bonded to at least a portion of the photonic integrated circuit chip and at least a portion of the ASIC chip.

Abstract: Methods, systems, and apparatus, including an optical receiver including a laser including a gain section; and a first tunable reflector configured to output a reference signal; a first coupler formed over the substrate; a shutter variable optical attenuator formed over the substrate, the shutter variable optical attenuator including an input port configured to receive the first portion of the reference signal from the laser; and an output port configured to provide or to block, based on a control signal, the first portion of the reference signal from the laser; and a second coupler including a first port configured to receive the first portion of the reference signal from the shutter variable optical attenuator; and a second port configured to (i) provide the first portion of the reference signal from the shutter variable optical attenuator to an optical analyzer or (ii) receive a data signal from a transmitter.

Abstract: Methods, systems, and apparatus, including an optical receiver including an optical source, including a substrate; a laser provided on the substrate, the laser having first and second sides and outputting first light from the first side and second light from the second side, the first light output from the first side of the laser has a first power and the second light output from the second side has a second power; and a first modulator that receives the first light and a second modulator that receives the second light, such that the power of the first light at an input of the first modulator is substantially equal to the power of the second light at an input of the second modulator.

Abstract: Methods, systems, and apparatus, including an optical receiver including a laser including a gain section; and a first tunable reflector configured to output a reference signal; a first coupler formed over the substrate; a shutter variable optical attenuator formed over the substrate, the shutter variable optical attenuator including an input port configured to receive the first portion of the reference signal from the laser; and an output port configured to provide or to block, based on a control signal, the first portion of the reference signal from the laser; and a second coupler including a first port configured to receive the first portion of the reference signal from the shutter variable optical attenuator; and a second port configured to (i) provide the first portion of the reference signal from the shutter variable optical attenuator to an optical analyzer or (ii) receive a data signal from a transmitter.

Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including multiple electrodes configured to receive the electrical signal, where at least one characteristics of a segment of the traveling wave active optical element is changed based on the electrical signal received by a corresponding electrode of the multiple electrodes; a ground electrode; and multiple bond contacts; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and multiple conductive vias electrically coupled to the conductive trace, where each conductive via of the multiple conductive vias is bonded with a respective bond contact of the multiple bond contacts of the photonic integrated circuit chip.

Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including a lumped active optical element; an electrode configured to receive an electrical signal, where at least one characteristics of the lumped active optical element is changed based on the electrical signal received by the electrode; a ground electrode; and a bond contact electrically coupled to the electrode; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and a conductive via bonded with the bond contact of the photonic integrated circuit chip, the conductive via electrically coupled to the conductive trace to provide the electrical signal to the electrode of the photonic integrated circuit chip.

Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including multiple electrodes configured to receive the electrical signal, where at least one characteristics of a segment of the traveling wave active optical element is changed based on the electrical signal received by a corresponding electrode of the multiple electrodes; a ground electrode; and multiple bond contacts; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and multiple conductive vias electrically coupled to the conductive trace, where each conductive via of the multiple conductive vias is bonded with a respective bond contact of the multiple bond contacts of the photonic integrated circuit chip.

Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including a lumped active optical element; an electrode configured to receive an electrical signal, where at least one characteristics of the lumped active optical element is changed based on the electrical signal received by the electrode; a ground electrode; and a bond contact electrically coupled to the electrode; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and a conductive via bonded with the bond contact of the photonic integrated circuit chip, the conductive via electrically coupled to the conductive trace to provide the electrical signal to the electrode of the photonic integrated circuit chip.

Abstract: Methods, systems, and apparatus, including an optical receiver including a laser including a gain section; and a first tunable reflector configured to output a reference signal; a first coupler formed over the substrate; a shutter variable optical attenuator formed over the substrate, the shutter variable optical attenuator including an input port configured to receive the first portion of the reference signal from the laser; and an output port configured to provide or to block, based on a control signal, the first portion of the reference signal from the laser; and a second coupler including a first port configured to receive the first portion of the reference signal from the shutter variable optical attenuator; and a second port configured to (i) provide the first portion of the reference signal from the shutter variable optical attenuator to an optical analyzer or (ii) receive a data signal from a transmitter.

Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including an active optical element; an electrode configured to receive an electrical signal; a ground electrode; and a bond contact electrically coupled to the electrode; and an ASIC chip including circuitry configured to provide the electrical signal; and a bond contact that is electrically coupled to the circuitry; an bridge chip bonded to at least a portion of the photonic integrated circuit chip and at least a portion of the ASIC chip.

Abstract: Methods, systems, and apparatus, including an optical receiver including an optical source, including a substrate; a laser provided on the substrate, the laser having first and second sides and outputting first light from the first side and second light from the second side, the first light output from the first side of the laser has a first power and the second light output from the second side has a second power; and a first modulator that receives the first light and a second modulator that receives the second light, such that the power of the first light at an input of the first modulator is substantially equal to the power of the second light at an input of the second modulator.