Patents by Inventor Miguel M. Saldana

Miguel M. Saldana has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding methods for microchannel plates
    Patent number: 7021522
    Abstract: Mating faces of a microchannel plate (MCP) (50) and a multi-layer ceramic body (80) unit are deposited with a thin film having protuberances (84) using a suitable metal selected for optimum diffusion at a desired temperatures and pressure. The metallized MCP (50) and multi-layer ceramic body (80) unit are then aligned and placed in a bonding fixture (F) that provides the necessary force applied to the components to initiate a diffusion bond at a desired elevated temperature. The bonding fixture (F) is then placed in a vacuum heat chamber (V) to accelerate the diffusion bonding process between the MCP (50) and the multi-layer ceramic body unit (80).
    Type: Grant
    Filed: January 24, 2005
    Date of Patent: April 4, 2006
    Assignee: Litton Systems, Inc.
    Inventors: Niels F. Jacksen, Michael J. Iosue, Miguel M. Saldana, Jay Scott Tucker
  • Diffusion bonding method for microchannel plates
    Patent number: 6938817
    Abstract: A microchannel plate (MCP) (50) and a dielectric insulator (80) are deposited with a thin film (54, 84) using a suitable metal selected for optimum diffusion. The metallized MCP (50) and dielectric insulator (80) are then aligned and placed in a bonding fixture (36) that provides the necessary force applied to the components to initiate a diffusion bond. The bonding fixture (36) is then placed in a vacuum heat chamber to accelerate the diffusion bonding process between the MCP (50) and the dielectric insulator (80).
    Type: Grant
    Filed: March 30, 2004
    Date of Patent: September 6, 2005
    Assignee: Litton Systems, Inc.
    Inventors: Miguel M. Saldana, Jay Scott Tucker, Michael J. Iosue
  • Bonding method for microchannel plates
    Patent number: 6874674
    Abstract: Mating faces of a microchannel plate (MCP) (50) and a multi-layer ceramic body (80) unit are deposited with a thin film having protuberances (84) using a suitable metal selected for optimum diffusion at a desired temperatures and pressure. The metallized MCP (50) and multi-layer ceramic body (80) unit are then aligned and placed in a bonding fixture (F) that provides the necessary force applied to the components to initiate a diffusion bond at a desired elevated temperature. The bonding fixture (F) is then placed in a vacuum heat chamber (V) to accelerate the diffusion bonding process between the MCP (50) and the multi-layer ceramic body unit (80).
    Type: Grant
    Filed: March 30, 2004
    Date of Patent: April 5, 2005
    Assignee: Litton Systems, Inc.
    Inventors: Niels F. Jacksen, Michael J. Iosue, Miguel M. Saldana, Jay Scott Tucker
  • BONDING METHOD FOR MICROCHANNEL PLATES
    Publication number: 20040188500
    Abstract: Mating faces of a microchannel plate (MCP) (50) and a multi-layer ceramic body (80) unit are deposited with a thin film having protuberances (84) using a suitable metal selected for optimum diffusion at a desired temperatures and pressure. The metallized MCP (50) and multi-layer ceramic body (80) unit are then aligned and placed in a bonding fixture (F) that provides the necessary force applied to the components to initiate a diffusion bond at a desired elevated temperature. The bonding fixture (F) is then placed in a vacuum heat chamber (V) to accelerate the diffusion bonding process between the MCP (50) and the multi-layer ceramic body unit (80).
    Type: Application
    Filed: March 30, 2004
    Publication date: September 30, 2004
    Applicant: LITTON SYSTEMS, INC.
    Inventors: Niels F. Jacksen, Michael J. Iosue, Miguel M. Saldana, Jay Scott Tucker
  • DIFFUSION BONDING METHOD FOR MICROCHANNEL PLATES
    Publication number: 20040191940
    Abstract: A microchannel plate (MCP) (50) and a dielectric insulator (80) are deposited with a thin film (54, 84) using a suitable metal selected for optimum diffusion. The metallized MCP (50) and dielectric insulator (80) are then aligned and placed in a bonding fixture (36) that provides the necessary force applied to the components to initiate a diffusion bond. The bonding fixture (36) is then placed in a vacuum heat chamber to accelerate the diffusion bonding process between the MCP (50) and the dielectric insulator (80).
    Type: Application
    Filed: March 30, 2004
    Publication date: September 30, 2004
    Applicant: LITTON SYSTEMS, INC.
    Inventors: Miguel M. SALDANA, Jay Scott TUCKER, Michael J. IOSUE