Patents by Inventor Mihai Tazlauanu
Mihai Tazlauanu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230125676Abstract: A radio frequency module includes: a primary board including: an upper surface carrying a radio controller; and a lower surface carrying antenna control elements; a plurality of spacing elements affixed to the lower surface and having a predetermined height extending away from the lower surface; and a secondary board affixed to the primary board by the plurality of spacing elements, separated from the lower surface of the primary board by an air gap with the predetermined height; the secondary board supporting a phased array of antenna elements electromagnetically coupled with the antenna control elements.Type: ApplicationFiled: October 21, 2022Publication date: April 27, 2023Inventors: Atabak RASHIDIAN, Mihai TAZLAUANU, Bradley Robert LYNCH
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Publication number: 20230092161Abstract: An antenna assembly configured to operate in a millimeter wave frequency of 30 GHz to 300 GHz, the antenna assembly being formed from a multi-layer printed circuit board having a plurality of eight square radiating rings positioned at generally equidistant locations within and surrounded by a rectangular grounded external ring which is positioned at the perimeter of the assembly. The antenna assembly also includes a plurality of feed network layers with a radio frequency chip and a baseband chip mounted onto the top of the plurality of feed network layers for controlling the operation of the eight square radiating rings.Type: ApplicationFiled: September 20, 2022Publication date: March 23, 2023Inventors: Atabak RASHIDIAN, Nima BAYAT-MAKOU, Marc SUPINSKI, Mihai TAZLAUANU
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Patent number: 11462833Abstract: A wireless communications module includes: a primary board including (i) a first surface bearing a radio controller, and defining a set of control contacts for connection to respective ports of the radio controller, and (ii) a second surface opposite the first surface; an antenna array integrated with the primary board, the antenna array including a plurality of unit cells each having: an inverted-L antenna having a planar element adjacent to the second surface of the primary board, and an orthogonal element extending from the planar element to a feed layer within the primary board; and a passive patch element between the planar element and the feed layer.Type: GrantFiled: August 28, 2020Date of Patent: October 4, 2022Assignee: PERASO TECHNOLOGIES INC.Inventors: Mahmoud Niroo Jazi, Marc Supinski, Mihai Tazlauanu
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Publication number: 20210066804Abstract: A wireless communications module includes: a primary board including (i) a first surface bearing a radio controller, and defining a set of control contacts for connection to respective ports of the radio controller, and (ii) a second surface opposite the first surface; an antenna array integrated with the primary board, the antenna array including a plurality of unit cells each having: an inverted-L antenna having a planar element adjacent to the second surface of the primary board, and an orthogonal element extending from the planar element to a feed layer within the primary board; and a passive patch element between the planar element and the feed layer.Type: ApplicationFiled: August 28, 2020Publication date: March 4, 2021Inventors: Mahmoud NIROO JAZI, Marc SUPINSKI, Mihai TAZLAUANU
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Publication number: 20210013582Abstract: A radio frequency module includes: a primary board including: an upper surface carrying a radio controller; and a lower surface carrying antenna control elements; a spacer affixed to the lower surface and having a predefined height extending away from the lower surface; and a secondary board affixed to the spacer, separated from the lower surface by an air gap having the predetermined height; the secondary board supporting a phased array of antenna elements.Type: ApplicationFiled: July 10, 2020Publication date: January 14, 2021Inventors: Atabak RASHIDIAN, Mihai TAZLAUANU, Marc SUPINSKI
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Patent number: 10854994Abstract: A broadband phased array antenna system is set forth comprising a support member; an antenna array mounted to the support member, the antenna array having a plurality of uniformly excited hybrid radiating elements arranged in a symmetric array on a substrate; a baseband controller mounted to the support member; a radio controller mounted to the support member for modulating and demodulating signals between the baseband controller and antenna array; and a communications interface for removably connecting and disconnecting the antenna system. In one aspect, the antenna array comprises a substrate; a plurality of uniformly excited hybrid radiating elements arranged in a symmetric array on the substrate; a hybrid feeding network for transmitting RF-signals to the hybrid radiating elements; and artificial materials surrounding opposite sides of the symmetric array for suppressing edge scattered fields and increasing gain of the antenna system.Type: GrantFiled: September 21, 2017Date of Patent: December 1, 2020Assignee: PERASO TECHNOLGIES INC.Inventors: Mahmoud Niroo Jazi, Mihai Tazlauanu
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Publication number: 20190089069Abstract: A broadband phased array antenna system is set forth comprising a support member; an antenna array mounted to the support member, the antenna array having a plurality of uniformly excited hybrid radiating elements arranged in a symmetric array on a substrate; a baseband controller mounted to the support member; a radio controller mounted to the support member for modulating and demodulating signals between the baseband controller and antenna array; and a communications interface for removably connecting and disconnecting the antenna system. In one aspect, the antenna array comprises a substrate; a plurality of uniformly excited hybrid radiating elements arranged in a symmetric array on the substrate; a hybrid feeding network for transmitting RF-signals to the hybrid radiating elements; and artificial materials surrounding opposite sides of the symmetric array for suppressing edge scattered fields and increasing gain of the antenna system.Type: ApplicationFiled: September 21, 2017Publication date: March 21, 2019Inventors: Mahmoud NIROO, Mihai TAZLAUANU
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Patent number: 9577340Abstract: An antenna apparatus includes a waveguide adapter plate for mounting an antenna flange and an RF system-in-package or other IC package. The waveguide adapter plate comprises a first surface and an opposing second surface and a waveguide flange interface. The waveguide flange interface comprises a waveguide channel section extending between the first surface and the second surface and a set of flange mounting holes extending from the first surface to the second surface. The waveguide adapter plate further includes a plurality of substrate alignment pins extending substantially perpendicular from the second surface.Type: GrantFiled: March 18, 2014Date of Patent: February 21, 2017Assignee: PERASO TECHNOLOGIES INC.Inventors: Mohammad Fakharzadeh, Andrew Charles Andrade, Saman Jafarlou, Bradley Robert Lynch, Mihai Tazlauanu
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Patent number: 9520635Abstract: An apparatus includes an IC package comprising a substrate having a first metal layer, a second metal layer, and a dielectric layer disposed between the first and second metal layers. The IC package further comprises an IC die disposed at a surface of the substrate and comprising RF circuitry. The first metal layer comprises a microstrip feedline extending from a pin of the IC die. The microstrip feedline includes a conductive trace having a probe element at a tip distal from the pin. The first metal layer further comprises a waveguide opening comprising a region surrounding the probe element, the region being substantially devoid of conductive material. The substrate further comprises a plurality of metal vias disposed at the perimeter of the region, the metal vias extending from the first metal layer to the second metal layer.Type: GrantFiled: April 25, 2013Date of Patent: December 13, 2016Assignee: PERASO TECHNOLOGIES INC.Inventors: Mohammad Fakharzadeh, Mihai Tazlauanu
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Patent number: 9257735Abstract: An antenna apparatus comprises a lower assembly and an upper assembly, which together forming a cavity to contain an RF circuit device. The upper assembly comprises a waveguide flange interface at an external surface of the upper assembly. The waveguide flange interface comprises a waveguide channel extending from the external surface to an internal surface forming a surface of the cavity. An opening of the waveguide channel at the internal surface is substantially centered about a first centerline of the upper assembly parallel with the external surface and offset from a second centerline of the upper assembly parallel with the external surface, whereby the second centerline perpendicular is to the first centerline. The upper assembly is removably attachable to the lower assembly in either of a first orientation or a second orientation, whereby the second orientation represents a 180 degree rotation of the upper assembly relative to the first orientation.Type: GrantFiled: April 25, 2013Date of Patent: February 9, 2016Assignee: Peraso Technologies Inc.Inventors: Mohammad Fakharzadeh, Mihai Tazlauanu, Bradley R. Lynch, Behzad Biglarbegian
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Publication number: 20150270617Abstract: An antenna apparatus includes a waveguide adapter plate for mounting an antenna flange and an RF system-in-package or other IC package. The waveguide adapter plate comprises a first surface and an opposing second surface and a waveguide flange interface. The waveguide flange interface comprises a waveguide channel section extending between the first surface and the second surface and a set of flange mounting holes extending from the first surface to the second surface. The waveguide adapter plate further includes a plurality of substrate alignment pins extending substantially perpendicular from the second surface.Type: ApplicationFiled: March 18, 2014Publication date: September 24, 2015Applicant: Peraso Technologies, Inc.Inventors: Mohammad Fakharzadeh, Andrew Charles Andrade, Saman Jafarlou, Bradley Robert Lynch, Mihai Tazlauanu
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Publication number: 20140285389Abstract: An apparatus includes an IC package comprising a substrate having a first metal layer, a second metal layer, and a dielectric layer disposed between the first and second metal layers. The IC package further comprises an IC die disposed at a surface of the substrate and comprising RF circuitry. The first metal layer comprises a microstrip feedline extending from a pin of the IC die. The microstrip feedline includes a conductive trace having a probe element at a tip distal from the pin. The first metal layer further comprises a waveguide opening comprising a region surrounding the probe element, the region being substantially devoid of conductive material. The substrate further comprises a plurality of metal vias disposed at the perimeter of the region, the metal vias extending from the first metal layer to the second metal layer.Type: ApplicationFiled: April 25, 2013Publication date: September 25, 2014Applicant: Peraso Technologies Inc.Inventors: Mohammad Fakharzadeh, Mihai Tazlauanu
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Publication number: 20140285383Abstract: An antenna apparatus comprises a lower assembly and an upper assembly, which together forming a cavity to contain an RF circuit device. The upper assembly comprises a waveguide flange interface at an external surface of the upper assembly. The waveguide flange interface comprises a waveguide channel extending from the external surface to an internal surface forming a surface of the cavity. An opening of the waveguide channel at the internal surface is substantially centered about a first centerline of the upper assembly parallel with the external surface and offset from a second centerline of the upper assembly parallel with the external surface, whereby the second centerline perpendicular is to the first centerline. The upper assembly is removably attachable to the lower assembly in either of a first orientation or a second orientation, whereby the second orientation represents a 180 degree rotation of the upper assembly relative to the first orientation.Type: ApplicationFiled: April 25, 2013Publication date: September 25, 2014Applicant: PERASO TECHNOLOGIES INC.Inventors: Mohammad Fakharzadeh, Mihai Tazlauanu, Bradley R. Lynch, Behzad Biglarbegian