Patents by Inventor Mihail Mihalov

Mihail Mihalov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7742889
    Abstract: Provided is a method of designing an optical metrology system for measuring structures on a workpiece wherein the optical metrology system is configured to meet one or more signal criteria. The design of the optical metrology system is optimized by using collected signal data in comparison to the one or more signal criteria. In one embodiment, the optical metrology system is used for stand alone systems. In another embodiment, the optical metrology system is integrated with a fabrication cluster in semiconductor manufacturing.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: June 22, 2010
    Assignee: Tokyo Electron Limited
    Inventors: Xinkang Tian, Manuel Madriaga, Ching-Ling Meng, Mihail Mihalov
  • Patent number: 7734437
    Abstract: Provided is an apparatus for designing an optical metrology system for measuring structures on a workpiece wherein the optical metrology system is configured to meet one or more signal criteria. The design of the optical metrology system is optimized by using collected signal data in comparison to set one or more signal criteria. In one embodiment, the optical metrology system is used for stand alone systems. In another embodiment, the optical metrology system is integrated with a fabrication cluster in semiconductor manufacturing.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: June 8, 2010
    Assignee: Tokyo Electron Limited
    Inventors: Xinkang Tian, Manuel Madriaga, Ching-Ling Meng, Mihail Mihalov
  • Publication number: 20090248339
    Abstract: Provided is a method of designing an optical metrology system for measuring structures on a workpiece wherein the optical metrology system is configured to meet one or more signal criteria. The design of the optical metrology system is optimized by using collected signal data in comparison to the one or more signal criteria. In one embodiment, the optical metrology system is used for stand alone systems. In another embodiment, the optical metrology system is integrated with a fabrication cluster in semiconductor manufacturing.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 1, 2009
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: XINKANG TIAN, MANUEL MADRIAGA, CHING-LING MENG, MIHAIL MIHALOV
  • Publication number: 20090248340
    Abstract: Provided is an apparatus for designing an optical metrology system for measuring structures on a workpiece wherein the optical metrology system is configured to meet one or more signal criteria. The design of the optical metrology system is optimized by using collected signal data in comparison to set one or more signal criteria. In one embodiment, the optical metrology system is used for stand alone systems. In another embodiment, the optical metrology system is integrated with a fabrication cluster in semiconductor manufacturing.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 1, 2009
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: XINKANG TIAN, MANUEL MADRIAGA, CHING-LING MENG, MIHAIL MIHALOV
  • Publication number: 20090248341
    Abstract: Provided is system and method for controlling a fabrication cluster using at least one parameter of a structure measured with an optical metrology system designed and configured to meet one or more signal criteria. The design of the optical metrology system is optimized by using collected signal data in comparison to set one or more signal criteria. In one embodiment, the optical metrology system is used for standalone systems. In another embodiment, the optical metrology system is integrated with a fabrication cluster in semiconductor manufacturing. At least one parameter determined from a signal measured using the optical metrology system is transmitted to a fabrication cluster. The at least one parameter is used to modify at least one process variable or equipment setting of the fabrication cluster.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 1, 2009
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: XINKANG TIAN, MANUEL MADRIAGA, CHING-LING MENG, MIHAIL MIHALOV
  • Publication number: 20090240537
    Abstract: Provided is an apparatus for designing an optical metrology system for measuring structures on a workpiece wherein the optical metrology system is configured to achieve a time budget for completing metrology process steps. The design of the optical metrology system is optimized by using collected operating data in comparison to the selected operating criteria. In one embodiment, the optical metrology system is used for stand alone systems. In another embodiment, the optical metrology system is integrated with fabrication clusters in semiconductor manufacturing.
    Type: Application
    Filed: March 18, 2008
    Publication date: September 24, 2009
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: XINKANG TIAN, EDRIC TONG, CHING-LING MENG, MIHAIL MIHALOV, MANUEL MADRIAGA
  • Publication number: 20090234687
    Abstract: Provided is a method of designing an optical metrology system for measuring structures on a workpiece wherein the optical metrology system is configured to achieve a time budget for completing metrology process steps. The design of the optical metrology system is optimized by using collected operating data in comparison to the selected operating criteria. In one embodiment, the optical metrology system is used for stand alone systems. In another embodiment, the optical metrology system is integrated with fabrication clusters in semiconductor manufacturing.
    Type: Application
    Filed: March 17, 2008
    Publication date: September 17, 2009
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: XINKANG TIAN, EDRIC TONG, CHING-LING MENG, MIHAIL MIHALOV, MANUEL MADRIAGA
  • Patent number: 7589845
    Abstract: Provided is system and method for controlling a fabrication cluster using at least one parameter of a structure measured with an optical metrology system designed and configured to meet one or more signal criteria. The design of the optical metrology system is optimized by using collected signal data in comparison to set one or more signal criteria. In one embodiment, the optical metrology system is used for standalone systems. In another embodiment, the optical metrology system is integrated with a fabrication cluster in semiconductor manufacturing. At least one parameter determined from a signal measured using the optical metrology system is transmitted to a fabrication cluster. The at least one parameter is used to modify at least one process variable or equipment setting of the fabrication cluster.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: September 15, 2009
    Assignee: Tokyo Electron Limited
    Inventors: Xinkang Tian, Manuel Madriaga, Ching-Ling Meng, Mihail Mihalov