Abstract: The present invention provides curable compositions that are free of metal catalysts including both tin and non-tin metal catalysts. The curable compositions employ a catalyst comprising curable polymers having reactive terminal silyl groups. In particular, a silylated carboxylic acid is an alternative to organotin or other metal catalysts. In addition, the catalyst may be used with an amino-containing adhesion promoter or a mixture of amine-containing adhesion promoters and an amino-containing siloxane. The combination of these materials accelerates the condensation curing of moisture curable silicones/non-silicones even in the absence of a metal-based catalyst.

Abstract: The present invention provides curable compositions that are free of metal catalysts including both tin and non-tin metal catalysts. The curable compositions employ a catalyst comprising curable polymers having reactive terminal silyl groups. In particular, a silylated carboxylic acid is an alternative to organotin or other metal catalysts. In addition, the catalyst may be used with an amino-containing adhesion promoter or a mixture of amine-containing adhesion promoters and an amino-containing siloxane. The combination of these materials accelerates the condensation curing of moisture curable silicones/non-silicones even in the absence of a metal-based catalyst.

Abstract: The present invention provides curable compositions comprising non-tin metal catalysts that accelerate the condensation curing of moisture-curable silicones/non-silicones. In particular, the present composition employs a catalyst system comprising an (alkyl)acrylic acid, a salt of an (alkyl)acrylic acid, or a mixture of two or more thereof. The (alkyl)acrylic acids or their salts exhibit catalytic activity comparable or superior to organotin such as dibutyltin dilaurate (DBTDL) and exhibit certain behavior in the presence of components such as adhesion promoters that allow for tuning or adjusting the cure characteristics of the present compositions and provide good adhesion and storage stability.