Patents by Inventor Miho ISHIHARA

Miho ISHIHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230144307
    Abstract: The present invention is a thermally conductive sheet comprising a plurality of unit layers, each comprising a silicone resin and a thermally conductive filler, the plurality of unit layers being laminated such that the plurality of unit layers are adhered to each other, wherein a volume content of the silicone resin is 32% by volume or less, and a compressive load at a sheet area of 25.4 mm×25.4 mm when the thermally conductive sheet is 30% compressed from a direction perpendicular to an adhesion plane on which the plurality of unit layers are adhered to each other is 7.0 kgf or less. According to the present invention, it is possible to improve the thermal conductivity and enhance the softness of a thermally conductive sheet using a silicone resin as a matrix component and composed of a large number of unit layers laminated as compared with the conventional one.
    Type: Application
    Filed: May 27, 2021
    Publication date: May 11, 2023
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventors: Hiroki KUDOH, Miho ISHIHARA
  • Patent number: 11618247
    Abstract: Provided is a thermally conductive sheet having high thermal conductivity not only in a thickness direction of the sheet but also in one direction along a plane direction of the sheet. The thermally conductive sheet is a thermally conductive sheet containing a scaly filler 12 in a polymer matrix 11, wherein the scaly filler 12 is oriented such that a long axis direction of a scale surface is along one of a first direction that is a thickness direction of the thermally conductive sheet and a second direction that is perpendicular to the first direction, and a transverse axis direction that is perpendicular to the long axis direction in the scale surface is along the other of the first direction and the second direction.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: April 4, 2023
    Assignee: SEKISUI POLYMATECH CO., LTD.
    Inventors: Hiroki Kudoh, Miho Ishihara
  • Publication number: 20220347996
    Abstract: Provided is a thermally conductive sheet having high thermal conductivity not only in a thickness direction of the sheet but also in one direction along a plane direction of the sheet. The thermally conductive sheet is a thermally conductive sheet containing a scaly filler 12 in a polymer matrix 11, wherein the scaly filler 12 is oriented such that a long axis direction of a scale surface is along one of a first direction that is a thickness direction of the thermally conductive sheet and a second direction that is perpendicular to the first direction, and a transverse axis direction that is perpendicular to the long axis direction in the scale surface is along the other of the first direction and the second direction.
    Type: Application
    Filed: October 26, 2020
    Publication date: November 3, 2022
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventors: Hiroki KUDOH, Miho ISHIHARA
  • Publication number: 20220289932
    Abstract: A thermally conductive sheet comprising a scaly filler and a fibrous filler in a polymer matrix, wherein a long axis direction of a scale surface of the scaly filler and a fiber axis direction of the fibrous filler are oriented in the same direction, and a mass ratio of the scaly filler to the fibrous filler (scaly filler/fibrous filler) is 55/45 or more.
    Type: Application
    Filed: September 16, 2020
    Publication date: September 15, 2022
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventors: Hiroki KUDOH, Miho ISHIHARA